Abstract: Disclosed herein are Flexible Radio Beacons and Flexible Delivery Structures for asset and inventory identification and management. The Flexible Radio Beacon is dormant until activated at time of use. The Flexible Radio Beacon has optional activation means and can be activated physically or electronically. The Flexible Radio Beacon and Flexible Delivery Structures make a flexible radio frequency (RF) tag useful for asset tracking. Disclosed herein is a method for using Flexible Radio Beacons and Flexible Delivery Structures in flexible RF tags for asset and inventory identification and management. Disclosed herein is a system for asset and inventory identification and management using Flexible Radio Beacons and Flexible Delivery Structures in flexible RF tags.

Abstract: Disclosed herein are Flexible Radio Beacons and Flexible Delivery Structures for asset and inventory identification and management. The Flexible Radio Beacon is dormant until activated at time of use. The Flexible Radio Beacon has optional activation means and can be activated physically or electronically. The Flexible Radio Beacon and Flexible Delivery Structures make a flexible radio frequency (RF) tag useful for asset tracking. Disclosed herein is a method for using Flexible Radio Beacons and Flexible Delivery Structures in flexible RF tags for asset and inventory identification and management. Disclosed herein is a system for asset and inventory identification and management using Flexible Radio Beacons and Flexible Delivery Structures in flexible RF tags.

Abstract: Disclosed herein is a Radio Frequency Location and/or Proximity Beacon receiver/transmitter with one or more tunable antennas and power levels and having the capability for cloud integration. Disclosed herein is a communication system utilizing a Radio Frequency Location and/or Proximity Beacon receiver/transmitter with one or more tunable antennas and power levels and having the capability for cloud integration. The communication system supports processing of communications regarding a radio frequency (RF) beacon for tracking location and/or proximity of field assets. Disclosed herein is a method of using a Radio Frequency Location and/or Proximity Beacon receiver/transmitter with one or more tunable antennas and power levels and having the capability for cloud integration. The method transmits communications regarding a radio frequency beacon for tracking location and/or proximity of field assets.

Abstract: Disclosed herein is a Radio Frequency Location and/or Proximity Beacon receiver/transmitter with one or more tunable antennas and power levels and having the capability for cloud integration. Disclosed herein is a communication system utilizing a Radio Frequency Location and/or Proximity Beacon receiver/transmitter with one or more tunable antennas and power levels and having the capability for cloud integration. The communication system supports processing of communications regarding a radio frequency (RF) beacon for tracking location and/or proximity of field assets. Disclosed herein is a method of using a Radio Frequency Location and/or Proximity Beacon receiver/transmitter with one or more tunable antennas and power levels and having the capability for cloud integration. The method transmits communications regarding a radio frequency beacon for tracking location and/or proximity of field assets.

Abstract: Disclosed herein are Flexible Radio Beacons and Flexible Delivery Structures for asset and inventory identification and management. The Flexible Radio Beacon is dormant until activated at time of use. The Flexible Radio Beacon has optional activation means and can be activated physically or electronically. The Flexible Radio Beacon and Flexible Delivery Structures make a flexible radio frequency (RF) tag useful for asset tracking. Disclosed herein is a method for using Flexible Radio Beacons and Flexible Delivery Structures in flexible RF tags for asset and inventory identification and management. Disclosed herein is a system for asset and inventory identification and management using Flexible Radio Beacons and Flexible Delivery Structures in flexible RF tags.

Abstract: Matched bipolar transistor pairs for use in differential transistor pair circuitry, current mirror transistor pair circuitry and voltage reference transistor pair circuitry are disclosed. Each transistor in the pair includes a base, emitter and a collector region and a doped polysilicon emitter contact, a metal emitter contact and an metal emitter interconnect which makes an electrical connection to the emitter region by way of the metal emitter contact and the polysilicon emitter contact. The metal emitter interconnect is displaced latterly away from the emitter region so that no part of the metal emitter interconnect overlies any portion of the emitter region.

Abstract: Matched bipolar transistor pairs for use in differential transistor pair circuitry, current mirror transistor pair circuitry and voltage reference transistor pair circuitry are disclosed. Each transistor in the pair includes a base, emitter and a collector region and a doped polysilicon emitter contact, a metal emitter contact and an metal emitter interconnect which makes an electrical connection to the emitter region by way of the metal emitter contact and the polysilicon emitter contact. The metal emitter interconnect is displaced latterly away from the emitter region so that no part of the metal emitter interconnect overlies any portion of the emitter region.

Abstract: A structure and method for forming contact structures in integrated circuits. A buffer layer is formed over an underlying conductive element. A first conductive layer is then deposited over the buffer layer and patterned to define a first interconnect layer. While the first interconnect layer is patterned, the buffer layer protects the underlying conductive element from damage. Portions of the buffer layer which are not covered by the first interconnect layer are then removed, and a second conductive layer is deposited over the integrated circuit. The second conductive layer is then anisotropically etched to form conductive sidewall spacers alongside the vertical sidewalls of the first interconnect layer, where at least one of the conductive sidewall spacers makes electrical contact with the underlying conductive element. Therefore, a conductive contact is made between the underlying conductive element and the first interconnect layer through at least one of the conductive sidewall spacers.

Abstract: A structure and method for forming contact structures in integrated circuits. A buffer layer is formed over an underlying conductive element. A first conductive layer is then deposited over the buffer layer and patterned to define a first interconnect layer. While the first interconnect layer is patterned, the buffer layer protects the underlying conductive element from damage. Portions of the buffer layer which are not covered by the first interconnect layer are then removed, and a second conductive layer is deposited over the integrated circuit. The second conductive layer is then anisotropically etched to form conductive sidewall spacers alongside the vertical sidewalls of the first interconnect layer, where at least one of the conductive sidewall spacers makes electrical contact with the underlying conductive element. Therefore, a conductive contact is made between the underlying conductive element and the first interconnect layer through at least one of the conductive sidewall spacers.

Abstract: A structure and method for forming contact vias in integrated circuits. An interconnect layer is formed on an underlying layer in an integrated circuit. A buffer region is then formed adjacent to the interconnect layer, followed by forming an insulating layer over the integrated circuit. Preferably, the insulating layer is made of a material which is selectively etchable over the material in the buffer region. A contact via is then formed through the insulating layer to expose a portion of the interconnect layer. During formation of the contact via, the buffer region acts as an etch stop and protects the underlying layer. The buffer region also ensures a reliable contact will be made in the event of an error in contact via placement.