Patents by Inventor Michael E. Mitchell

Michael E. Mitchell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132643
    Abstract: The process includes providing an aqueous mixture including perfluorinated monomers, a fluoroalkyl sulfinic acid or salt thereof, and an oxidizing agent capable of oxidizing the fluoroalkyl sulfinic acid or salt thereof and polymerizing the perfluorinated Nmonomers under free radical conditions to provide an aqueous dispersion of the fluoropolymer. The fluoroalkyl group has from one to three carbon atoms. The amount of perfluorooctanoic acid or salt thereof in the aqueous dispersion of the fluoropolymer as polymerized is not more than 25 nanograms per gram of the fluoropolymer. A fluoropolymer made by the process is also described.
    Type: Application
    Filed: February 23, 2022
    Publication date: April 25, 2024
    Inventors: Tatsuo Fukushi, Miguel A. Guerra, Klaus Hintzer, Joshua E. Malinsky, Michael H. Mitchell, Justin T. Roop, Steffen Vowinkel
  • Publication number: 20220340963
    Abstract: This invention relates to methods and compositions for assessing the suitability of a graft for transplantation by measuring total and/or specific cell-free nucleic acids (such as cf-DNA) and/or cell lysis. Specifically, the method comprising obtaining an amount of total short fragment cf-DNA and/or graft-specific short fragment cf-DNA released from a potential graft (e.g., ex vivo), e.g.
    Type: Application
    Filed: September 21, 2020
    Publication date: October 27, 2022
    Applicant: Natera, Inc.
    Inventors: Paula E. NORTH, Michael E. MITCHELL, Aoy T. MITCHELL, Paul G. DAFT, Donna K. MAHNKE
  • Patent number: 7939378
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: May 10, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Donald C Abbott, Michael E Mitchell, Paul R Moehle, Douglas W Romm
  • Patent number: 7245006
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Grant
    Filed: August 25, 2005
    Date of Patent: July 17, 2007
    Assignee: Texas Instruments Incorporated
    Inventors: Donald C. Abbott, Michael E. Mitchell, Paul R. Moehle, Douglas W. Romm
  • Patent number: 6953986
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: October 11, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Donald C. Abbott, Michael E. Mitchell, Paul R. Moehle, Douglas W. Romm
  • Patent number: 6838757
    Abstract: For a leadframe for use with integrated circuit chips, a continuous strip of sheet-like base metal is pre-plated with a layer of nickel fully covering the base metal, further on one surface with a palladium layer in a thickness suitable for bonding wire attachment, and on the opposite surface with a layer of either palladium or lead-free solder in a thickness suitable for parts attachment. The leadframe structure is then stamped from the sheet so that the base metal is exposed at the stamped edges, enhancing adhesion to molding compounds.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: January 4, 2005
    Assignee: Texas Instruments Incorporated
    Inventors: Donald C. Abbott, Michael E. Mitchell, Paul R. Moehle
  • Publication number: 20020070434
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 13, 2002
    Inventors: Donald C. Abbott, Michael E. Mitchell, Paul R. Moehle, Douglas W. Romm
  • Publication number: 20020003292
    Abstract: For a leadframe for use with integrated circuit chips, a continuous strip of sheet-like base metal is pre-plated with a layer of nickel fully covering the base metal, further on one surface with a palladium layer in a thickness suitable for bonding wire attachment, and on the opposite surface with a layer of either palladium or lead-free solder in a thickness suitable for parts attachment. The leadframe structure is then stamped from the sheet so that the base metal is exposed at the stamped edges, enhancing adhesion to molding compounds.
    Type: Application
    Filed: July 6, 2001
    Publication date: January 10, 2002
    Inventors: Donald C. Abbott, Michael E. Mitchell, Paul R. Moehle
  • Patent number: 6081091
    Abstract: A motor controller includes an input terminal (22), a frequency selective network, a first controller, and a second controller. The input terminal is adapted to be coupled to a drive phase of a motor (16) for receiving a signal (24). The frequency selective network (18) has an input coupled to the input terminal (22) and an output for providing a first signal representative of the back EMF signal within a frequency range corresponding to a predetermined harmonic frequency above a primary frequency thereof. The first controller (20) has an input coupled to the output of the frequency selective network (18) and an output for providing a second signal representative of a position or a velocity of a rotor of the motor (16). The second controller (10) has an input coupled to the output of the first controller (20) and an output for providing a third signal. The third signal indicates how the motor (16) is to be driven.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: June 27, 2000
    Assignee: Motorola, Inc.
    Inventors: Michael E. Mitchell, David A. Hayner