Abstract: A method of plating a conductive material includes providing conductive material. An aqueous bath solution comprised of at least one solvent, a nickel source, a phosphorous source, a reducing agent, a pH-controlling material, a stabilizer and a complexing agent is used to plate the conductive material. The conductive material contacts the bath solution. Electroless plating occurs on top of the conductive material and the plating includes from about 88 to 93 wt. % nickel and from at least 7 to about 12 wt. % phosphorous to form a nickel-phosphorous plating. The thickness of the plating is from about 50 to about 300 nm and the plating is generally uniform with the thickness of the surface being within 20 percent of the average thickness across the surface of the plating.

Abstract: Various embodiments concern a flexure comprising a base metal layer. The base metal layer can have a void between a first lateral side and a second lateral side. The flexure can further comprise a plurality of traces in an array. The plurality of traces can extend over the void and between the first and second lateral sides. The plurality of traces can comprise a pair of outer traces respectively located on lateral ends of the array and at least one inner trace between the pair of outer traces. The plurality of traces and the first and second lateral sides can be spaced relative to each other such that adjacent traces of the plurality of traces capacitively couple to each other and the pair of outer traces capacitively couple with each other through the first and second lateral sides.

Abstract: Various embodiments concern a flexure comprising a base metal layer. The base metal layer can have a void between a first lateral side and a second lateral side. The flexure can further comprise a plurality of traces in an array. The plurality of traces can extend over the void and between the first and second lateral sides. The plurality of traces can comprise a pair of outer traces respectively located on lateral ends of the array and at least one inner trace between the pair of outer traces. The plurality of traces and the first and second lateral sides can be spaced relative to each other such that adjacent traces of the plurality of traces capacitively couple to each other and the pair of outer traces capacitively couple with each other through the first and second lateral sides.

Abstract: Various embodiments concern a method for forming a trace array by modeling a trace array having a plurality of traces, each trace having a plurality of trace segments corresponding to elements of a filter circuit having alternating high and low impedance elements. The alternating high and low impedance elements can correspond to inductors and capacitors. For each trace segment, a delay constant is measured between a plurality of nodes that are longitudinally arrayed along the trace segment. The delay constant can be a phase delay. The length of each trace segment is set based on the delay constant of the trace segment. The length of each trace segment can be set such that the trace has a linear group delay response across an operational frequency range of the flexure. A trace array is then formed based on the set lengths.

Abstract: Various embodiments concern a flexure comprising a base metal layer. The base metal layer can have a void between a first lateral side and a second lateral side. The flexure can further comprise a plurality of traces in an array. The plurality of traces can extend over the void and between the first and second lateral sides. The plurality of traces can comprise a pair of outer traces respectively located on lateral ends of the array and at least one inner trace between the pair of outer traces. The plurality of traces and the first and second lateral sides can be spaced relative to each other such that adjacent traces of the plurality of traces capacitively couple to each other and the pair of outer traces capacitively couple with each other through the first and second lateral sides.

Abstract: Jumper constructions for an integrated lead flexure for a disk drive head suspension include a conductive base layer, an insulating layer over the base layer, a plurality of traces arranged on the insulating layer, and an isolated conductor layer arranged under the insulating layer. The plurality of traces include a first trace and a second trace and the isolated conductor layer is electrically isolated from the conductive base layer and electrically connects the first and second traces.

Abstract: An integrated lead flexure includes a base region and a gimbal extending from the base region and having a slider mounting region. A conductive assembly, which is configured to carry current between the slider mounting region and the base region, includes a current carrying structure electrically connected with a pattern of conductive lossy material. The pattern of conductive lossy material is configured to reduce a bandwidth of the current carrying structure.

Abstract: An integrated lead flexure comprising a base region, a gimbal extending from the base region and conductive traces. The gimbal includes spring arms and a slider mounting region extending from the spring arms. The conductive traces include one or more unsupported trace sections extending from head bond pads on the slider mounting region to the base region off of the spring arms. One or more metal islands on the unsupported trace sections enhance the impedance characteristics of traces. An insulating layer is located between the traces and the metal islands.

Abstract: Jumper constructions for an integrated lead flexure for a disk drive head suspension include a conductive base layer, an insulating layer over the base layer, a plurality of traces arranged on the insulating layer, and an isolated conductor layer arranged under the insulating layer. The plurality of traces include a first trace and a second trace and the isolated conductor layer is electrically isolated from the conductive base layer and electrically connects the first and second traces.

Abstract: An integrated lead flexure includes traces with windowed or reduced width portions. The flexure includes a metal base layer with a plurality of apertures, an insulating layer on the metal base layer, and one or more conductive traces formed on the insulating layer and extending over the metal base layer and the plurality of apertures. Backed portions of the one or more conductive traces that extend over the metal base layer have a first width, and unbacked portions of the one or more conductive traces that extend over the plurality of apertures have a second width that is less than the first width.

Abstract: An integrated lead flexure having a spring metal layer, a dielectric insulating layer on a side of the spring metal layer, a conductor layer on the side of the insulating layer opposite the spring metal layer and a coverlay on the side of the conductor layer opposite the insulating layer. The flexure further includes base region, a gimbal region extending from the base region, and a tail region extending from the base region opposite the gimbal region. The conductor layer includes terminal pads at the tail region and head bond pads at the gimbal region. Traces in the conductor layer extend between the terminal pads and the head bond pads across the tail, base and gimbal regions. One or more spring metal windows in the spring metal layer at the tail region are adjacent to substantial portions of at least some of the traces. One or more coverlay windows in the coverlay at the tail region are adjacent to substantial portions of the tail region spring metal windows.

Abstract: A disk drive head suspension flexure having a gimbal region and a tail includes a metal base layer, an insulation layer over the base layer and two or more pairs of adjacent traces extending over the insulation layer from the gimbal region to the tail. Each trace includes terminals on the gimbal region and tail. Two or more conductive metal signal transmission planes are embedded within the insulation layer and extend from the gimbal region to the tail between the pairs of traces and metal base layer. Each of the embedded signal transmission planes has a width extending across a width of a pair of the traces. Terminals on the gimbal region and tail are coupled to the signal transmission planes by connection vias extending through the insulation layer.

Abstract: A webbed ground plane includes a plurality of slots and a plurality of struts between the slots. The slots and struts have generally equal lengths and extend below a length of the leads such that eddy current losses in the leads are reduced to near zero.

Abstract: A method for efficiently producing low resistance electrical contacts between stainless steel and conductive layers in integrated lead suspensions and components. The method includes applying an amount of current for a period of time which is effective to reduce the resistance to a desired level. One embodiment of the invention includes applying a 100 mA current for 16 msec to a contact formed by thermosetting conductive epoxy. Resistance levels below 1 ohm can be achieved.