Patents by Inventor Michael E. S. Chapman

Michael E. S. Chapman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with flag support structure
    Patent number: 7012324
    Abstract: A lead frame (201) for a packaged electronic device having split flag structures (205, 207) coupled by support structures (219). The support structures include bend portions (233) for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (301). In one embodiment, the packaged electronic device includes an inertial sensor (515).
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: March 14, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Gary G. Li, Michael E. S. Chapman, Dave S. Mahadevan