Abstract: A semiconductor module includes a first circuit carrier including one or more heat generating elements mounted on an upper surface of the first circuit carrier, a second circuit carrier mounted over the first circuit carrier and being vertically spaced apart from the upper surface of the first circuit carrier, and a temperature sensor that is fixedly attached to the second circuit carrier and is arranged in a vertical space between the lower surface of the second circuit carrier and the upper surface of the first circuit carrier, wherein the temperature sensor is arranged in sufficient proximity to a first one of the heat generating elements to obtain a direct temperature measurement from the first one of the heat generating elements.

Abstract: A method for producing a power semiconductor module arrangement includes: arranging at least one semiconductor substrate in a housing, each semiconductor substrate including a first metallization layer attached to a dielectric insulation layer, the housing including a through hole extending through a component of the housing; inserting a fastener into the through hole such that an upper portion of the fastener is not inserted into the through hole; arranging a printed circuit board on the housing; arranging the housing on a mounting surface, the mounting surface comprising a hole, wherein the housing is arranged on the mounting surface such that the through hole is aligned with the hole in the mounting surface; and exerting a force on the printed circuit board such that the force causes the fastener to be pressed into the hole in the mounting surface so as to secure the housing to the mounting surface.

Abstract: A method for producing a power semiconductor module arrangement includes: arranging a semiconductor substrate in a housing, the housing including a through hole extending through a component of the housing; inserting a pin or bolt into the through hole such that an upper end of the pin/bolt is not inserted into the through hole; arranging a printed circuit board on the housing; arranging the housing on a heat sink having a hole, the housing being arranged on the heat sink such that the through hole is aligned with the hole in the heat sink; and by way of a first pressing tool, exerting a force on a defined contact area of the printed circuit board and pressing the pin/bolt into the hole in the heat sink, wherein the defined contact area is arranged directly above the pin/bolt.

Abstract: A power semiconductor module includes an electrically insulating carrier plate with a structured, electrically conducting metallization layer disposed on a surface thereof, and a connection pin having two ends and being adhered to the carrier plate, one end of the connection pin being electrically connected to the metallization layer. The module further includes a semiconductor device adhered to the carrier plate and electrically connected to the metallization layer, and a discrete circuit including a voltage-or-current-or-both controlling device, the voltage-or-current-or-both controlling device being operatively coupled with the semiconductor device and being integrated in the connection pin at one of or between the two ends of the connection pin.

Abstract: A method for producing a power semiconductor module arrangement includes: arranging a semiconductor substrate in a housing, the housing including a through hole extending through a component of the housing; inserting a pin or bolt into the through hole such that an upper end of the pin/bolt is not inserted into the through hole; arranging a printed circuit board on the housing; arranging the housing on a heat sink having a hole, the housing being arranged on the heat sink such that the through hole is aligned with the hole in the heat sink; and by way of a first pressing tool, exerting a force on a defined contact area of the printed circuit board and pressing the pin/bolt into the hole in the heat sink, wherein the defined contact area is arranged directly above the pin/bolt.