Patents by Inventor Michael Edison

Michael Edison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100095618
    Abstract: Provided are materials and methods related to a roofing material comprising at least two layers of polymeric materials, a top layer exposed to the environment and a bottom layer contacting the roof structure, the top layer including an amount of metallic appearing special effect pigment material to impart a metallic appearance. The polymeric material may be a thermoplastic olefin resin, a polyvinyl chloride resin, or other material. Additionally, the polymeric materials contain UV stabilizers and/or flame retardants, smoke suppressants or other fillers.
    Type: Application
    Filed: October 20, 2009
    Publication date: April 22, 2010
    Applicant: BASF CORPORATION
    Inventors: Michael Edison, Gregory R. Coughlin, Doreen C. Becker
  • Publication number: 20020161828
    Abstract: A software package comprises an application broker export module exportable from a first device to a second device, the application broker export module including an instance opening sub-module for opening a first instance of an application broker for managing operation of applications exported from the first device to the second device and for opening a second instance of the application broker for managing operation of applications between the second device and a third device. A method of communicating comprises the steps of forwarding to a first device a first request from a second device, the first request including an application broker software package, initiating at the first device a first instance of an application broker from the application broker software package, wherein the first instance includes an object to process the first request and establishing a first connection between the first and second devices in response to the first request.
    Type: Application
    Filed: April 30, 2001
    Publication date: October 31, 2002
    Inventors: Michael Edison, Wei Dong Yi, Erik Lawrence Peterson