Patents by Inventor Michael Ehmann

Michael Ehmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220235470
    Abstract: A method for fabricating a semiconductor device comprises depositing a TiW layer on a semiconductor substrate, depositing a Ti layer on the TiW layer, depositing a Ni alloy layer on the Ti layer, depositing an Ag layer on the Ni alloy layer, at least partially covering the Ag layer with photoresist, wet etching the Ag layer and the Ni alloy layer, and dry etching the Ti layer and the TiW layer.
    Type: Application
    Filed: January 24, 2022
    Publication date: July 28, 2022
    Inventors: Saurabh Roy, Matteo Dainese, Michael Ehmann, Hiroshi Narahashi, Johanna Schlaminger, Katharina Teichmann, Sigrid Wabnig
  • Publication number: 20220213156
    Abstract: The present invention relates to new peptides the amino acid sequences of which are derived from HD-5, for use in the treatment and/or prevention of Herpesviridae infections, in particular for treating and/or preventing a Betaherpesviridae infection, such as a HCMV-infection.
    Type: Application
    Filed: May 8, 2020
    Publication date: July 7, 2022
    Inventors: Jan Wehkamp, Michael Schindler, Rebecca Boeffert, Ramona Businger, Dirk Ehmann
  • Publication number: 20200343094
    Abstract: An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.
    Type: Application
    Filed: July 10, 2020
    Publication date: October 29, 2020
    Applicant: Infineon Technologies AG
    Inventors: Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz, Kamil Karlovsky, Evelyn Napetschnig, Werner Robl, Tobias Schmidt, Joachim Seifert, Frank Wagner, Stefan Woehlert
  • Patent number: 10741402
    Abstract: An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: August 11, 2020
    Assignee: Infineon Technologies AG
    Inventors: Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz, Kamil Karlovsky, Evelyn Napetschnig, Werner Robl, Tobias Schmidt, Joachim Seifert, Frank Wagner, Stefan Woehlert
  • Patent number: 10573611
    Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: February 25, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Kamil Karlovsky, Evelyn Napetschnig, Michael Ehmann, Mark James Harrison, Anton Pugatschow
  • Publication number: 20190051624
    Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.
    Type: Application
    Filed: October 17, 2018
    Publication date: February 14, 2019
    Inventors: Kamil Karlovsky, Evelyn Napetschnig, Michael Ehmann, Mark James Harrison, Anton Pugatschow
  • Patent number: 10115688
    Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 30, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Kamil Karlovsky, Evelyn Napetschnig, Michael Ehmann, Mark Harrison, Anton Pugatschow
  • Publication number: 20180082848
    Abstract: An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 22, 2018
    Applicant: Infineon Technologies AG
    Inventors: Paul Frank, Gretchen Adema, Thomas Bertaud, Michael Ehmann, Eric Graetz, Kamil Karlovsky, Evelyn Napetschnig, Werner Robl, Tobias Schmidt, Joachim Seifert, Frank Wagner, Stefan Woehlert
  • Publication number: 20160351516
    Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 1, 2016
    Inventors: Kamil Karlovsky, Evelyn Napetschnig, Michael Ehmann, Mark Harrison, Anton Pugatschow
  • Patent number: 8435584
    Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: May 7, 2013
    Assignee: NATAIS
    Inventor: Michael Ehmann
  • Publication number: 20120251683
    Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.
    Type: Application
    Filed: April 10, 2012
    Publication date: October 4, 2012
    Inventor: Michael EHMANN
  • Patent number: 8173187
    Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: May 8, 2012
    Assignee: Natais
    Inventor: Michael Ehmann
  • Publication number: 20090169688
    Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.
    Type: Application
    Filed: September 27, 2006
    Publication date: July 2, 2009
    Inventor: Michael Ehmann
  • Publication number: 20070176999
    Abstract: A printer and method for operating a printer are provided. The printer has a printhead adapted to heat a thermal donor medium to transfer donor material from a donor web to a receiver medium; a receiver medium path having guides shaped to direct receiver medium along a receiver medium travel path to and from a position in registration with the printhead with said receiver medium path having at least one change of receiver medium direction therein causing said receiver medium to bend; and a motorized platen for moving receiver medium through the receiver medium path, wherein said receiver medium path is further shaped so that the change in receiver medium direction occurs in a portion of the receiver medium path that takes the receiver medium from a position in registration with the printhead.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 2, 2007
    Inventor: Michael Ehmann
  • Publication number: 20070008398
    Abstract: A thermal printer and method for operating a thermal printer are provided. The thermal printer has a receiver medium path leading past a print nip between a print head and platen. A processor causes an urge roller to move the receiver medium in the forward direction until a trailing edge of the receiver medium is moved to a point where reverse movement of the receiver medium causes the receiver medium to located against a stop surface. The processor then enables the receiver medium to travel in the reverse direction to engage the stop surface wherein the receiver medium path guides the receiver medium along a path of known length from the stop surface to a print line at the print nip.
    Type: Application
    Filed: July 7, 2005
    Publication date: January 11, 2007
    Inventors: Robert Cloutier, David Cornell, Michael Ehmann
  • Publication number: 20060216095
    Abstract: A printer has a path for a sheet. A donor web is disposed on one side of the path; a platen roller is disposed on the other side of the path and supports the sheet during printing. An edge sensor is located in path at a known distance from the nip of the print head and the platen. Edge sensor senses the lead edge of the sheet and then the control circuit drives the lead edge to a distance D from the heat line of the print head. The head lowers, is selectively energized and the platen moves to carry the donor web and sheet past the head and provide a borderless printed image on the sheet.
    Type: Application
    Filed: March 28, 2005
    Publication date: September 28, 2006
    Inventor: Michael Ehmann