Abstract: An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.

Abstract: A method for fabricating a semiconductor device comprises depositing a TiW layer on a semiconductor substrate, depositing a Ti layer on the TiW layer, depositing a Ni alloy layer on the Ti layer, depositing an Ag layer on the Ni alloy layer, at least partially covering the Ag layer with photoresist, wet etching the Ag layer and the Ni alloy layer, and dry etching the Ti layer and the TiW layer.

Abstract: An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.

Abstract: An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.

Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.

Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.

Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.

Abstract: An electronic device, an electronic module comprising the electronic device and methods for fabricating the same are disclosed. In one example, the electronic device includes a semiconductor substrate and a metal stack disposed on the semiconductor substrate, wherein the metal stack comprises a first layer, wherein the first layer comprises NiSi.

Abstract: A semiconductor device includes a contact metal layer disposed over a semiconductor surface of a substrate, a diffusion barrier layer disposed over the contact metal layer, an inert layer disposed over the diffusion barrier layer, and a solder layer disposed over inert layer.

Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.

Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.

Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.

Abstract: The invention concerns an assembly for preparing and presenting an edible composition designed to be puffed including a first portion defining a chamber for enabling the puffed composition to be presented, and a second portion defining a storage chamber designed to include at least one non-puffed composition, the second portion being arranged in the first portion. The invention also concerns a method for preparing a composition to be puffed using the assembly.

Abstract: A printer and method for operating a printer are provided. The printer has a printhead adapted to heat a thermal donor medium to transfer donor material from a donor web to a receiver medium; a receiver medium path having guides shaped to direct receiver medium along a receiver medium travel path to and from a position in registration with the printhead with said receiver medium path having at least one change of receiver medium direction therein causing said receiver medium to bend; and a motorized platen for moving receiver medium through the receiver medium path, wherein said receiver medium path is further shaped so that the change in receiver medium direction occurs in a portion of the receiver medium path that takes the receiver medium from a position in registration with the printhead.

Abstract: A thermal printer and method for operating a thermal printer are provided. The thermal printer has a receiver medium path leading past a print nip between a print head and platen. A processor causes an urge roller to move the receiver medium in the forward direction until a trailing edge of the receiver medium is moved to a point where reverse movement of the receiver medium causes the receiver medium to located against a stop surface. The processor then enables the receiver medium to travel in the reverse direction to engage the stop surface wherein the receiver medium path guides the receiver medium along a path of known length from the stop surface to a print line at the print nip.

Abstract: A printer has a path for a sheet. A donor web is disposed on one side of the path; a platen roller is disposed on the other side of the path and supports the sheet during printing. An edge sensor is located in path at a known distance from the nip of the print head and the platen. Edge sensor senses the lead edge of the sheet and then the control circuit drives the lead edge to a distance D from the heat line of the print head. The head lowers, is selectively energized and the platen moves to carry the donor web and sheet past the head and provide a borderless printed image on the sheet.