Patents by Inventor Michael Emmelius

Michael Emmelius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation-polymerizable mixture and process for producing a solder resist mask
    Patent number: 5387486
    Abstract: The present invention relates to a radiation-polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80.degree. to 150.degree. C. to form a stencil which is resistant under soldering conditions.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: February 7, 1995
    Assignee: Morton International, Inc.
    Inventors: Michael Emmelius, Walter Herwig, Kurt Erbes, Rudolf Decker
  • Radiation-polymerizable mixture and process for producing a solder resist mask
    Patent number: 5264324
    Abstract: The present invention relates to a radiation-polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80.degree. to 150.degree. C. to form a stencil which is resistant under soldering conditions.
    Type: Grant
    Filed: September 20, 1990
    Date of Patent: November 23, 1993
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Michael Emmelius, Walter Herwig, Kurt Erbes, Rudolf Decker