Abstract: A method for electrically conductively contacting an optoelectronic component having at least one protective layer, including: providing the optoelectronic component having the at least one protective layer with at least one busbar arranged below the at least one protective layer, forming at least one opening by at least one laser beam in the at least one protective layer, wherein at least one busbar arranged below the at least one protective layer is partly exposed, such that the at least one busbar is not damaged, introducing a low-melting solder into the at least one opening of the at least one protective layer, aligning and fixing an electrically conductive element that is flexible on a side of the at least one opening opposite the at least one busbar, and forming an electrically conductive connection element in the at least one opening.

Abstract: An encapsulation system, including a first encapsulation formed from at least one front barrier layer on a front face of the optoelectronic component and at least one rear barrier layer on a reverse face of the optoelectronic component with at least one first connecting material disposed in between, and a second encapsulation formed from at least one front protective layer on the front face of the optoelectronic component and at least one rear protective layer on the reverse face of the optoelectronic component with at least one second connecting material disposed in between, wherein the first encapsulation surrounds the optoelectronic component such that the first encapsulation projects beyond the optoelectronic component by a first edge region, and the second encapsulation surrounds the first encapsulation comprising the optoelectronic component such that the second encapsulation projects beyond the first edge region of the first encapsulation by a second edge region.

Abstract: A method for electrically conductively contacting an optoelectronic component having at least one protective layer, including: providing the optoelectronic component having the at least one protective layer with at least one busbar arranged below the at least one protective layer, forming at least one opening by at least one laser beam in the at least one protective layer, wherein at least one busbar arranged below the at least one protective layer is partly exposed, such that the at least one busbar is not damaged, introducing a low-melting solder into the at least one opening of the at least one protective layer, aligning and fixing an electrically conductive element that is flexible on a side of the at least one opening opposite the at least one busbar, and forming an electrically conductive connection element in the at least one opening.

Abstract: A lighting module including a plate-type active element having two electrode layers and a light-emitting layer located between the electrode layers, and having a transparent, plate-type support element, on which the active element is located, at least the electrode layer facing the support element being transparent. In the lighting module, the transparent electrode layer has a structure with a thickness that varies periodically.

Abstract: A lighting module or an organic solar cell, including two plate-type electrodes and an active material located between the two electrodes. In the module, one of the two electrodes includes a transparent material and is provided with a grid structure with at least one metallic conductor track running on the surface or in the material of the electrode, only some sections of the conductor track being connected to the electrode material.

Abstract: A light-emission device with a two-dimensional OLED element and an encapsulation element for protecting the OLED element. The light-emission device furthermore has a support, on which the OLED element is arranged in such a way that the encapsulation element points toward the support, and an electrical conductor element for an electrical connection between the support and the OLED element. wherein the electrical conductor element is elastic in a normal direction to the OLED element. By way of example, the conductor element can be helical. As a result of the elastic property thereof, the conductor element can absorb mechanical tension while ensuring reliable electrical contacting. Hence, this can reduce or even avoid the risk of the electrical connection between the support and the OLED element being disadvantageously influenced or impaired by forces which can occur when handling the light-emission device or which can be generated by temperature variations.

Abstract: A light module having a plate-shaped active element, which is formed by an OLED or QLED, and a plate-shaped, transparent carrier element having a surface on which the active element is arranged. The carrier element has an edge region that protrudes in relation to the active element. An optical element is arranged on a side of the carrier element opposite the active element and is designed to form a light-emitting area of the light module, which is widened compared to the area of the active element.

Abstract: A lighting module including a plate-type active element having two electrode layers and a light-emitting layer located between the electrode layers, and having a transparent, plate-type support element, on which the active element is located, at least the electrode layer facing the support element being transparent. In the lighting module, the transparent electrode layer has a structure with a thickness that varies periodically.

Abstract: A lighting module or an organic solar cell, including two plate-type electrodes and an active material located between the two electrodes.

Abstract: A light-emission device with a two-dimensional OLED element and an encapsulation element for protecting the OLED element. The light-emission device furthermore has a support, on which the OLED element is arranged in such a way that the encapsulation element points toward the support, and an electrical conductor element for an electrical connection between the support and the OLED element. wherein the electrical conductor element is elastic in a normal direction to the OLED element. By way of example, the conductor element can be helical. As a result of the elastic property thereof, the conductor element can absorb mechanical tension while ensuring reliable electrical contacting. Hence, this can reduce or even avoid the risk of the electrical connection between the support and the OLED element being disadvantageously influenced or impaired by forces which can occur when handling the light-emission device or which can be generated by temperature variations.

Abstract: The invention relates to organic light emitting diodes (OLEDs) and to a method for the production thereof. The organic light emitting diodes according to the invention are distinguished in that a substance is integrated in the layer stack, the electrical conductivity of which is reduced by energy input, as a result of which irreversible damage to organic light emitting diodes, as can occur for example with the formation of defects or particles, can be prevented.