Abstract: The invention relates to a marker device and a tracking system for tracking the marker device, wherein the marker device comprises a rotationally oscillatable magnetic object and wherein the rotational oscillation is excitable by an external magnetic field, i.e. a magnetic field which is generated by a magnetic field providing unit 20, 31 that is located outside of the marker device. The rotational oscillation of the magnetic object induces a current in coils, wherein based on these induced currents the position and optionally also the orientation of the marker device is determined. This wireless kind of tracking can be carried out with relatively small marker devices, which can be placed, for instance, in a guidewire, the marker devices can be read out over a relatively large distance and it is possible to use a single marker device for six degrees of freedom localization.

Abstract: A recirculation brewing process and apparatus for performing the same are disclosed. In some embodiments, the coffee brewing process comprises: a brew chamber to hold a packed chamber of coffee grounds; and a pump to force a liquid under pressure through the packed chamber of coffee grounds to extract coffee flavor from the coffee grounds into the liquid using acoustic cavitation.

Abstract: Described herein is an electronics circuit board design tool. The tool includes a substantially planar non-conductive substrate adapted to be positioned on an electronics breadboard. The substrate includes a plurality of guide apertures at locations corresponding to predefined electrical inputs of the breadboard such that electronic components are able to be connected to the electronics breadboard through respective ones of the guide apertures. The tool also includes indicia printed on a surface of substrate. The indicia is indicative of the type or position of electrical connections or components to be connected with the breadboard through corresponding ones of the guide apertures.

Abstract: At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.

Abstract: An infusing apparatus and method for using the same are disclosed. In one embodiment, the apparatus comprises a portable device for infusing a liquid with flavor from material, where the device comprises: a liquid container to store a liquid; a brew chamber to hold the material; and a pump to generate a pressure differential over tunnels within the material and over the brew chamber.

Abstract: A recirculation brewing process and apparatus for performing the same are disclosed. In one embodiment, the coffee brewing process comprises: a brew chamber to hold a packed chamber of coffee grounds; and a pump to force a liquid under pressure through the packed chamber of coffee grounds over multiple brewing cycles to extract coffee flavor from the coffee grounds into the liquid using a temperature agnostic infusing brewing process, the liquid under pressure causing a pressure differential over tunnels within the coffee grounds and over the brew chamber when forced through the chamber each cycle of a plurality of cycles to cause extraction of the flavor into the liquid.

Abstract: At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method allows for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects for electrical testing. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure. All or part of the temporary test structure is removed so as not to affect product performance. The temporary test structure can contain electrical test pads which provide a way to make temporary connections to small interconnect landings or features at extreme tight pitch to fan them out to testable pads sizes and pitches.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method allows for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects for electrical testing. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure. All or part of the temporary test structure is removed so as not to affect product performance. The temporary test structure can contain electrical test pads which provide a way to make temporary connections to small interconnect landings or features at extreme tight pitch to fan them out to testable pads sizes and pitches.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method allows for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects for electrical testing. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure. All or part of the temporary test structure is removed so as not to affect product performance. The temporary test structure can contain electrical test pads which provide a way to make temporary connections to small interconnect landings or features at extreme tight pitch to fan them out to testable pads sizes and pitches.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method allows for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects for electrical testing. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure. All or part of the temporary test structure is removed so as not to affect product performance. The temporary test structure can contain electrical test pads which provide a way to make temporary connections to small interconnect landings or features at extreme tight pitch to fan them out to testable pads sizes and pitches.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method allows for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects for electrical testing. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure. All or part of the temporary test structure is removed so as not to affect product performance. The temporary test structure can contain electrical test pads which provide a way to make temporary connections to small interconnect landings or features at extreme tight pitch to fan them out to testable pads sizes and pitches.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method allows for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects for electrical testing. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure. All or part of the temporary test structure is removed so as not to affect product performance. The temporary test structure can contain electrical test pads which provide a way to make temporary connections to small interconnect landings or features at extreme tight pitch to fan them out to testable pads sizes and pitches.

Abstract: Roller assemblies for hanging panels are disclosed herein. Roller assemblies according to the present disclosure are configured to support a hanging panel and include an elongate rail configured to be mounted on a surface. The roller assembly includes a trolley assembly, which includes a bearing assembly configured to translate the trolley assembly along the elongate rail and a bracket coupled to the bearing assembly and configured to be coupled to the hanging panel. The elongate rail includes a rail adjustment system configured to facilitate adjusting a position and/or an orientation of the elongate rail with respect to the surface. The rail adjustment system is concealed in a rail-assembled configuration, and includes at least two spaced-apart rail adjustment mechanisms.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method is particularly useful for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects and for electrical testing. The suitable material for the temporary test structure is TiW for a single layer structure, or Cu or Cu alloy over Ti or TiW for a bilayer structure with thickness in a range of about 20 nm to 1200 nm. Excimer laser ablation can be used to form the temporary test structure. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure.

Abstract: A method of forming a temporary test structure for device fabrication is provided. The method is particularly useful for electrically testing conductive interconnects during controlled collapse chip connections (C4) fabrication and/or through-silicon vias (TSVs) during interposer fabrication. The method includes providing a substrate containing a plurality of electrically conductive interconnects extending vertically to top surface of the substrate. A temporary test structure is formed to connect the plurality of interconnects and for electrical testing. The suitable material for the temporary test structure is TiW for a single layer structure, or Cu or Cu alloy over Ti or TiW for a bilayer structure with thickness in a range of about 20 nm to 1200 nm. Excimer laser ablation can be used to form the temporary test structure. Electrical testing is performed on the substrate by probing at different test locations on the temporary test structure.

Abstract: A 3-dimensional (3D) video rendering device may convert a first left view video of a decompressed 3D video having a first frame rate to generate a second left view video having a second frame rate, and convert a first right view video having the first frame rate to generate a second right view video having the second frame rate. The second left view video having a particular pixel resolution may be converted by the 3D video rendering device to generate a third left view video having full pixel resolution of the decompressed 3D video. The second right view video having the particular pixel resolution may be converted to generate a third right view video having the full pixel resolution. The 3D video rendering device may generate a sequence of video frames for 3D video display based on the third left view video and the third right view video.

Abstract: Roller assemblies for hanging panels are disclosed herein. Roller assemblies according to the present disclosure are configured to support a hanging panel and include an elongate rail configured to be mounted on a surface. The roller assembly includes a trolley assembly, which includes a bearing assembly configured to translate the trolley assembly along the elongate rail and a bracket coupled to the bearing assembly and configured to be coupled to the hanging panel. The elongate rail includes a rail adjustment system configured to facilitate adjusting a position and/or an orientation of the elongate rail with respect to the surface. The rail adjustment system is concealed in a rail-assembled configuration, and includes at least two spaced-apart rail adjustment mechanisms.

Abstract: An apparatus is provided for extending a data model. The apparatus may include at least one memory and at least one processor configured to provide information to a queue responsive to detection of new data associated with a user or an encounter or detection of modified data associated with the user or encounter. The processor is also configured to identify a pattern(s) based on analyzing the information in the queue. The information includes content of the new data or the modified data. The patterns include instructions specifying a calculation(s) for execution based on usage of the new data or the modified data. The processor is also configured to provide results of the calculation(s) to a database to enable access of the results by an application(s) or a communication device(s) responsive to executing a pattern(s) and determining the results of the calculation. Corresponding computer program products and methods are also provided.

Abstract: A device includes ocular image processing features. The device obtains ocular image data without requiring artificial lenses to capture the ocular image data. The device may, for example, obtain sensor data from a touch sensor associated with a display, recognize ocular image data within the sensor data, and process the ocular image data for any reason. This processing may occur regardless of the fact that the intended purpose of the sensor data was not for ocular imaging, but was intended for another purpose, such as detecting touch interactions with the display.