Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract: Methods and articles of manufacture for storage and shipping of nanowires are disclosed. One disclosed method includes: (a) providing a nanowire suspension including nanowires suspended in a liquid; and (b) disposing the nanowire suspension in a container for storage and shipping, where the container is configured to inhibit agglomeration of nanowires from the nanowire suspension.

Abstract: Methods and articles of manufacture for storage and shipping of nanowires are disclosed. One disclosed method includes: (a) providing a nanowire suspension including nanowires suspended in a liquid; and (b) disposing the nanowire suspension in a container for storage and shipping, where the container is configured to inhibit agglomeration of nanowires from the nanowire suspension.

Abstract: A transparent conductor includes a film of a conductive ceramic and conductive additives at least partially incorporated into the film and localized within a region of the film. A thickness of the region is less than an overall thickness of the film, and at least one of the conductive additives has an aspect ratio of at least 3. The transparent conductor has a sheet resistance that is less than an intrinsic sheet resistance of the film.

Abstract: A transparent conductor includes a film of a conductive ceramic. Additives are at least partially incorporated into the film. The additives are at least one of electrically conductive and semiconducting, and at least one of the additives has an aspect ratio of at least 3.

Abstract: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.

Abstract: A transparent conductor includes a film of a conductive ceramic. Additives are at least partially incorporated into the film. The additives are at least one of electrically conductive and semiconducting, and at least one of the additives has an aspect ratio of at least 3.

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract: A portable, personal apparatus for treating drinking water comprises a generally tubular or cylindrical filter housing containing filtration media and water-permeable screen or mesh or felt or membrane or netting layer at the top and bottom ends of the filter. The design of the apparatus involves the bottle exterior and interior contouring to the filter and enables the efficient and rapid gravity flow of water in through the filter. The apparatus may be configured such that water is first passed through a top reservoir designed to receive water, followed by a porous mesh, followed by granular filtration and antimicrobial media agitated by turbulent motion of influent water, followed by a porous mesh before reaching a durable and reusable water containment vessel.

Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract: Disclosed are methods for incorporating additives, such as chemically active particles, into the surfaces of articles or into coatings disposed atop articles. The disclosed methods are also applicable to conventional molding techniques, and can be performed in batch or continuous fashion.