Abstract: A transceiver assembly includes a receptacle guide frame configured to be mounted to a host circuit board, where the receptacle guide frame has a front being open to an interior space, and where the receptacle guide frame is configured to receive a pluggable module through the front. A receptacle connector is received within the interior space of the receptacle guide frame at a rear of the receptacle guide frame. The receptacle connector includes contacts having contact tails configured to be mounted to a circuit board. The contacts have retention sections positioned at a predetermined location relative to the contact tails, and the contacts have mating sections configured for mating with a mating connector. A housing holds the contacts and has a front and a rear with a cavity at the front being configured to receive the mating connector. The housing has a shelf at the rear. A stuffer bar is separately provided from the housing and securely coupled to the rear of the housing.

Abstract: A stacked jack multi-port shielded and magnetically conditioned connector assembly is provided for assembly in three distinct configurations. In one configuration where power over ethernet is not required, the connector assembly has modular jack terminals which are directly connected to a motherboard. In a second configuration, the connector assembly can receive conditioned and controlled electrical signals to the connector, whereby power over ethernet may be provided through designated ones of the modular jack terminals. In a third configuration, the connector assembly is configured for an integrated power over ethernet card, whereby the device is provided as an integrated assembly.

Abstract: A stacked jack multi-port shielded and magnetically conditioned connector assembly is provided having a multi-port electrical connector housing having a plurality of housing ports adjacent a mating face thereof. A shield member comprises a base shield portion and sidewall portions extending from side edges of the base shield portion. The sidewall portions extend in opposite directions from the base shield portion. A plurality of modular connector subassemblies are adapted for stacking with the base shield portion positioned therebetween, and with one of the shield sidewall portions positioned against a side of one of the housings and the other shield sidewall portion is positioned against a side of the other housing.

Abstract: A stacked jack multi-port shielded and magnetically conditioned connector assembly is provided for assembly in three distinct configurations. One configuration is where power over ethernet is not required, but rather modular jack contacts are directly connected to a motherboard. A second configuration, the connector assembly can be configured to be enabled to receive conditioned and controlled electrical signals to the connector, whereby power over ethernet may be provided through designated ones of the modular jack contacts. Alternatively, the connector can be configured for an integrated power over ethernet card, where the device is provided as an integrated assembly.

Abstract: A structure for providing direct feedback of power emitted by a surface emitting light emitting device and the subsequent optical power control of the device is disclosed. In a preferred embodiment, an array of vertical cavity surface emitting lasers emit light having a wavelength which is partially detected by an array of photodetectors. The semi-transparent photodetectors array has an absorption coefficient which is relatively small at the wavelength of light emitted by the lasers. Most of the emitted light will be transmitted through the detectors while a small insignificant fraction in magnitude is absorbed and converted to photocurrent for monitoring the output power of the devices. The structure of the device of the present disclosure is simple, readily fabricated through uncomplicated techniques and of materials which do not effect the beam characteristics of the surface emitting devices.

Abstract: An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

Abstract: An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

Abstract: An optical fiber transmission apparatus for limiting the optical modes which were emitted from a source in such a way to impinge on an optical fiber to extract a high bandwidth from the fiber. The apparatus includes a lens or aperture to control the angle and distribution of light launched into the fiber. The apparatus achieves reproducibly high bandwidths in large core step-index optical fibers of short transmission length distances. The lens or aperture introduces light from the source into the fiber at an angle at which substantially no intermode delay occurs as the light propagates down the fiber. An integral fiber optic coupling assembly that includes an optical electronic component receptacle, the lens and/or aperture, and an optical fiber connector interface which provides low cost easy to manufacture assembly is also disclosed. A unitary plastic housing provides the function of a lens and mechanical reference or locating features for the light source and optical fiber.

Abstract: A method for making an optical fiber transmission apparatus for limiting the optical modes which were emitted from a source in such a way to impinge on an optical fiber to extract a high bandwidth from the fiber. The apparatus includes a lens or aperture to control the angle and distribution of light launched into the fiber. The apparatus achieves reproducibly high bandwidths in large core step-index optical fibers of short transmission length distances. The lens or aperture introduces light from the source into the fiber at an angle at which substantially no intermode delay occurs as the light propagates down the fiber. An integral fiber optic coupling assembly that includes an optical electronic component receptacle, the lens and/or aperture, and an optical fiber connector interface which provides low cost easy to manufacture assembly is also disclosed. A unitary plastic housing provides the function of a lens and mechanical reference or locating features for the light source and optical fiber.

Abstract: Methods and apparatus are set forth for passively and precisely aligning pairs of objects, in particular, microelectronic components such as semiconductor lasers and fibers, utilizing fiducial marks. Additionally, methods and apparatus are set forth for combining passive and active alignment techniques where high degrees of alignment precision are required. Still further, techniques are described for fixing prealigned objects, independent of how the objects are prealigned, to a mounting surface in a manner that maintains the relative (aligned) position of the objects. Further yet, in order to help minimize manufacturing costs with respect to production of, for example, microelectronic assemblies, batch processing techniques are described which utilize the novel alignment procedures contemplated by the invention.