Patents by Inventor Michael F. McAllister
Michael F. McAllister has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8929086Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: GrantFiled: September 26, 2005Date of Patent: January 6, 2015Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Harald Pross, Gerhard H. Ruehle, Wolfgang A. Scholz, Gerhard Schoor
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Patent number: 8785289Abstract: A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.Type: GrantFiled: August 26, 2013Date of Patent: July 22, 2014Assignee: International Business Machines CorporationInventors: Tae Hong Kim, Michael F. McAllister, Michael J. Shapiro, Edmund J. Sprogis
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Publication number: 20130344675Abstract: A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.Type: ApplicationFiled: August 26, 2013Publication date: December 26, 2013Applicant: International Business Machines CorporationInventors: Tae Hong Kim, Michael F. McAllister, Michael J. Shapiro, Edmund J. Sprogis
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Patent number: 8558345Abstract: A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.Type: GrantFiled: November 9, 2009Date of Patent: October 15, 2013Assignee: International Business Machines CorporationInventors: Tae Hong Kim, Edmund J. Sprogis, Michael F. McAllister, Michael J. Shapiro
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Publication number: 20110108948Abstract: A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.Type: ApplicationFiled: November 9, 2009Publication date: May 12, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tae Hong Kim, Edmund J. Sprogis, Michael F. McAllister, Michael J. Shapiro
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Patent number: 7930820Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: GrantFiled: September 26, 2005Date of Patent: April 26, 2011Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Harald Pross, Gerhard H. Ruehle, Wolfgang A. Scholz, Gerhard Schoor
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Patent number: 7543373Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: GrantFiled: September 26, 2005Date of Patent: June 9, 2009Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Harald Pross, Gerhard H. Ruehle, Wolfgang A. Scholz, Gerhard Schoor
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Patent number: 7363688Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both, using a removable and restorable engineering change plug.Type: GrantFiled: April 28, 2006Date of Patent: April 29, 2008Assignee: International Business Machines CorporationInventors: Michael F. McAllister, John G. Torok
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Patent number: 7344919Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.Type: GrantFiled: September 26, 2005Date of Patent: March 18, 2008Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Harald Pross, Gerhard H. Ruehle, Wolfgang A. Scholz, Gerhard Schoor
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Patent number: 7077660Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.Type: GrantFiled: February 10, 2004Date of Patent: July 18, 2006Assignee: International Business Machines CorporationInventors: Michael F. McAllister, John G. Torok
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Patent number: 6954984Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.Type: GrantFiled: July 25, 2002Date of Patent: October 18, 2005Assignee: International Business Machines CorporationInventors: Michael F. McAllister, John G. Torok
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Publication number: 20040159915Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.Type: ApplicationFiled: February 10, 2004Publication date: August 19, 2004Applicant: International Business Machines CorporationInventors: Michael F. McAllister, John G. Torok
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Publication number: 20040016114Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.Type: ApplicationFiled: July 25, 2002Publication date: January 29, 2004Applicant: International Business Machines CorporationInventors: Michael F. McAllister, John G. Torok
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Patent number: 6605953Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: July 19, 2002Date of Patent: August 12, 2003Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Patent number: 6549024Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: July 19, 2002Date of Patent: April 15, 2003Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Patent number: 6538460Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: GrantFiled: March 16, 2000Date of Patent: March 25, 2003Assignee: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Patent number: 6529023Abstract: A counterbalancing arrangement for use with a compressive land grid array connector system provides a counterbalancing load element at a side of a system circuit board opposite a back side holding an integrated circuit chip substrate via the connector system. In a first aspect, the counterbalancing load element is a probe template and spacer element providing measurement across to the integrated circuiting. In another aspect, the counterbalancing load element is a mirror image integrated circuit land grid array connector system.Type: GrantFiled: May 17, 2001Date of Patent: March 4, 2003Assignee: International Business Machines CorporationInventors: Wiren D. Becker, Michael F. McAllister, Gerhard Ruehle
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Publication number: 20020186002Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: ApplicationFiled: July 19, 2002Publication date: December 12, 2002Applicant: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephan R. Richter, Gerhard Ruehle
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Publication number: 20020180422Abstract: A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.Type: ApplicationFiled: July 19, 2002Publication date: December 5, 2002Applicant: International Business Machines CorporationInventors: Michael F. McAllister, Klaus K. Kempter, Charles F. Pells, Stephen R. Richter, Gerhard Ruehle
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Publication number: 20020171442Abstract: A counterbalancing arrangement for use with a compressive land grid array connector system provides a counterbalancing load element at a side of a system circuit board opposite a back side holding an integrated circuit chip substrate via the connector system. In a first aspect, the counterbalancing load element is a probe template and spacer element providing measurement across to the integrated circuiting. In another aspect, the counterbalancing load element is a mirror image integrated circuit land grid array connector system.Type: ApplicationFiled: May 17, 2001Publication date: November 21, 2002Inventors: Wiren D. Becker, Michael F. McAllister, Gerhard Ruehle