Abstract: In a surface inspection system for detecting particles on a surface, a light source mounted to illuminate the surface provides multiple wavelength ranges of electromagnetic radiation. An optical detector produces an image of the surface. An optical signal is produced indicative of returned electromagnetic radiation at each of a plurality of the multiple wavelength ranges from a field of view on the surface. A processor operating on the optical signals resolves presence of a contaminant as a function of the optical signals, and produces a contaminant signal responsive to presence of a contaminant. A heating means positioned to evolve contaminants from the surface is responsively coupled to be activated in response to a contaminant signal. The multiple wavelength ranges comprise ultraviolet, visible, and infrared wavelengths. The processor comprises means to perform false color contrast stretching.

Abstract: A composition for radiation shielding or range of compositions which compositions may be used for a variety of radiation shielding applications. With proper adhesive selection and processing, the construction forms an integral bond with the craft as compatible adhesives form strong bonds. This eliminates the potential for delaminating associated with the use of metallic layered shielding. While prior art protects electronics with a direct coating to electronic packages, this approach allows larger equipment systems, such as optics, or spectrometers, to be shielded.

Abstract: Foreign materials (contaminants) will usually affect many other properties of the surface as well as affecting the adhesion. This allows the use of indirect or off-contact measurement of surface energy to evaluate the quality of the surface. Our approach is environmentally friendly, uses no consumables and is totally benign to the surfaces being bonded. In order to detect contaminants on a substrate, the optical reflectivity properties of the materials can be compared. Metals and composites have different reflectivity than organics, which have low reflectivity (i.e. high absorption). This can usually be seen in white light by using a selected part of the light spectrum to enhance visual contrast between the two materials. This is because the reflectivity of a material changes with the wavelength of light. UV light can cause fluorescence of a few materials but this limits performance for a versatile machine.

Abstract: Embodiments of the invention comprise a filler to block the radiation, and an organic resin, such as epoxy or modified cyanate ester. Fillers may comprise passivated Gadolinium and Tungsten. The Gadolinium may be passivated by atomic deposition of a nano-layer of silica or alumina. The passivation layer reduces the chemical activity of the filler while retaining the maximum attenuation performance of the pure metal. Radiation performance is optimized by reaching optimum material density, as density is proportional to radiation attenuation performance. The proportion of passivated Gadolinium to Tungsten may be selected based on the radiation shielding performance and environment for such species as X-ray, thermal neutrons, gamma and cosmic rays.

Abstract: A composition for coating a surface comprises an adhesive cementitious material such as a geopolymer, a kaolin, or mixtures thereof, and a filler material. Various filler materials are disclosed, with which the coating composition may be used for thermal mapping, oxygen protection to organic dopants, thermal protection, radiation protection, anti-tamper protection, mechanical abrasion protection, or high emission of electromagnetic radiation. With certain fillers, the coating composition remains thermally stable up to 1200° C., and/or remains thermally operable for brief periods up to about 1400° C. When the coating composition includes a wetting agent, and the filler is between 0.01 micrometer and 10 micrometers in size, the coating composition can take the form of an aqueous spray. With certain fillers, the coating composition can cure at a temperature below 100° C. The coating composition can also be a thick film which provides resistance to cracking and peeling during severe thermal exposure.

Abstract: A composition for radiation shielding or range of compositions is disclosed, with which the compositions may be used for a variety of radiation shielding applications. With proper adhesive selection and processing, the construction forms an integral bond with the craft as compatible adhesives form strong bonds. This eliminates the potential for delaminating associated with the use of metallic layered shielding. While prior art protects electronics with a direct coating to electronic packages, this approach allows larger equipment systems, such as optics, or spectrometers to be shielded.

Abstract: A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.

Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Abstract: A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.

Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Abstract: A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.

Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.

Abstract: A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.