Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: A gang clip includes a plurality of clips formed from a metal each having a center region oriented along a first plane and an angled clip foot having a foot height, a length and a bend angle sufficient to electrically contact a lead terminal of the leadframe to be used to form a device. Adjacent ones of the plurality of clips are joined to one another by a first tie bar also oriented along the first plane. The first tie bar extends to a saw street region located between adjacent ones of the clips. A second tie bar attached to the first tie bar is positioned in the saw street region.

Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: An integrated circuit that includes micro-etched channels on a bottom surface is provided. The integrated circuit includes a lead frame having electrically conductive contact terminal pads and a die centrally disposed in the lead frame. Wire bonds provide an electrical connection from the die to the electrically conductive contact terminal pads. A mold compound encapsulates the die and the wire bonds, where a bottom surface of the mold compound is flush with a bottom surface of the contact terminal pads. A channel is defined in the bottom surface of the mold compound around a periphery of the contact terminal pads.

Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: A gang clip includes a plurality of clips formed from a metal each having a center region oriented along a first plane and an angled clip foot having a foot height, a length and a bend angle sufficient to electrically contact a lead terminal of the leadframe to be used to form a device. Adjacent ones of the plurality of clips are joined to one another by a first tie bar also oriented along the first plane. The first tie bar extends to a saw street region located between adjacent ones of the clips. A second tie bar attached to the first tie bar is positioned in the saw street region.

Abstract: An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.

Abstract: An integrated circuit (IC) chip socket that can include a non-conductive housing and moveable pogo pins positioned within the non-conductive housing. The moveable pogo pins can include active pogo pins, each active pogo pin being positioned to a corresponding lead of an IC chip insertable into the IC chip socket. Moveable pogo pins can also include an inactive pogo pin positioned to avoid contacting each lead of the IC chip insertable into the IC chip socket.

Abstract: An integrated circuit (IC) chip socket that can include a non-conductive housing and moveable pogo pins positioned within the non-conductive housing. The moveable pogo pins can include active pogo pins, each active pogo pin being positioned to a corresponding lead of an IC chip insertable into the IC chip socket. Moveable pogo pins can also include an inactive pogo pin positioned to avoid contacting each lead of the IC chip insertable into the IC chip socket.

Abstract: An improved BGA spring probe pin with a spring actuated solder ball receptacle that grips the sides of the solder ball during probing. A method of operating a BGA prober with improved BGA spring probe pins.

Abstract: An improved BGA spring probe pin with a spring actuated solder ball receptacle that grips the sides of the solder ball during probing. A method of operating a BGA prober with improved BGA spring probe pins.