Abstract: A method of manufacturing a device having embedded memory including a plurality of memory cells. During manufacturing test, a first test stress is applied to selected cells of the plurality of memory cells with a built-in self test. At least one weak memory cell is identified. The at least one weak memory cell is repaired. A second test stress is applied to the selected cells and the repaired cells with the built-in self test.

Abstract: A random access memory circuit comprises a plurality of memory cells and at least one decoder coupled to the memory cells, the decoder being configurable for receiving an input address and for accessing one or more of the memory cells in response thereto. The random access memory circuit further comprises a plurality of sense amplifiers operatively coupled to the memory cells, the sense amplifiers being configurable for determining a logical state of one or more of the memory cells. A controller coupled to at least a portion of the sense amplifiers is configurable for selectively operating in at least one of a first mode and a second mode. In the first mode of operation, the controller enables one of the sense amplifiers corresponding to the input address and disables the sense amplifiers not corresponding to the input address. In the second mode of operation, the controller enables substantially all of the sense amplifiers.