Patents by Inventor Michael Fritton

Michael Fritton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetically encapsulated sensor and process for its production
    Patent number: 6591703
    Abstract: A sensor has a housing, in which there is arranged a thermosetting molding compound which is encapsulated in a linear region in the longitudinal direction of the housing by a thermoplastic molding compound. The two molding compounds meet at a conical contact surface. An electrical terminal element is electrically connected to a printed-circuit board via lines. The printed-circuit board is embedded into the two molding compounds at the level of the center line, the thermosetting molding compound enclosing all the electrically active components and conductor tracks of the printed-circuit board. Annular grooves are arranged on the outer side of the thermosetting molding compound. Due to the encapsulation, the thermoplastic molding compound engages in these annular grooves in a positively and non-positively engaging manner.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: July 15, 2003
    Assignee: Balluff GmbH
    Inventors: Ernst Gass, Michael Fritton, Josef Mayer, Walter Roth
  • Hermetically encapsulated sensor and process for its production
    Publication number: 20010038883
    Abstract: A sensor has a housing, in which there is arranged a thermosetting molding compound which is encapsulated in a linear region in the longitudinal direction of the housing by a thermoplastic molding compound. The two molding compounds meet at a conical contact surface. An electrical terminal element is electrically connected to a printed-circuit board via lines. The printed-circuit board is embedded into the two molding compounds at the level of the center line, the thermosetting molding compound enclosing all the electrically active components and conductor tracks of the printed-circuit board. Annular grooves are arranged on the outer side of the thermosetting molding compound. Due to the encapsulation, the thermoplastic molding compound engages in these annular grooves in a positively and non-positively engaging manner.
    Type: Application
    Filed: May 2, 2001
    Publication date: November 8, 2001
    Applicant: Gebhard Balluff GmbH & Co.
    Inventors: Ernst Gass, Michael Fritton, Josef Mayer, Walter Roth