Patents by Inventor Michael G. Bischoff

Michael G. Bischoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5808856
    Abstract: A high energy multilayer ceramic capacitor formed of alternating ceramic and electrode layers, the capacitor being suitable for use in implantable medical devices. The ceramic layers are comprised of a dielectric composition of lead magnesium niobate with small amounts of dopants, namely, lithium niobate, copper oxide, magnesium titanate, manganese niobate, and zirconium oxide, with appropriate electrical terminations connected to the electrode layers. The capacitor thus fabricated exhibits greatly reduced ferroelectric effect, namely, less than 30% over a bias range of 0-1,000 volts. It has a breakdown voltage of at least 700 volts, a leakage current less than 10 pico amps at 1,000 volts, an energy density of greater than 10 J/cc, has a rectangular form factor 1.5 inches by 2.0 inches by 0.06 inch thick, and weighs no more than 30 grams.
    Type: Grant
    Filed: December 12, 1996
    Date of Patent: September 15, 1998
    Assignee: Microelectronic Packaging, Inc.
    Inventors: William P. Bischoff, Michael G. Bischoff
  • Patent number: 5603147
    Abstract: A high energy multilayer ceramic capacitor formed of alternating ceramic and electrode layers, the capacitor being suitable for use in implantable medical devices. The ceramic layers are comprised of a dielectric composition of lead magnesium niobate with small amounts of dopants, namely, lithium niobate, copper oxide, magnesium titanate, manganese niobate, and zirconium oxide, with appropriate electrical terminations connected to the electrode layers. The capacitor thus fabricated exhibits greatly reduced ferroelectric effect, namely, less than 30% over a bias range of 0-1,000 volts. It has a breakdown voltage of at least 700 volts, a leakage current less than 10 pico amps at 1,000 volts, an energy density of greater than 10 J/cc, has a rectangular form factor 1.5 inches by 2.0 inches by 0.06 inch thick, and weighs no more than 30 grams.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 18, 1997
    Assignee: Microelectronic Packaging, Inc.
    Inventors: William P. Bischoff, Michael G. Bischoff