Abstract: A building structure comprising a first film and a second film. The first film and the second film are each impregnated with L-Dopa. The building structure further includes regolith bulk material between the first film and the second film.

Abstract: Disclosed are various embodiments for a rule builder for data processing. A proper subset of a data set of strings is selected from one or more columns into which the data set is organized. A selection pattern is identified based at least in part on substring selections and a set of pattern rules. The substring selections are received by way of a first user interface that presents strings from the proper subset. The selection pattern is separately represented in the individual substring selections. A second user interface is generated to present the selection pattern.

Abstract: Disclosed are various embodiments for a rule builder for data processing. A proper subset of a data set of strings is selected from one or more columns into which the data set is organized. A selection pattern is identified based at least in part on substring selections and a set of pattern rules. The substring selections are received by way of a first user interface that presents strings from the proper subset. The selection pattern is separately represented in the individual substring selections. A second user interface is generated to present the selection pattern.

Abstract: Disclosed are various embodiments for a rule builder for data processing. A proper subset of a set of strings is selected. A first user interface is generated that is configured to present the proper subset of the set of strings. The first user interface is further configured to obtain multiple substring selections corresponding to each one of the proper subset of the set of strings. One or more selection patterns are identified based at least in part on the corresponding substring selections. A second user interface is generated that is configured to present the selection patterns for user verification.

Abstract: Techniques are described herein to converge and conditionally filter data and to present such data in a manner that is beneficial to situational data analysis, in association with emergency management, law enforcement, or other such situations. Data may be combined to create enhanced situational awareness for responders and improve their decision making ability.

Abstract: A bearing cage defines an overall axial length and includes a first end portion defining a first contact surface extending at a radially-outermost diameter of the bearing cage a first axial contact length, and a second end portion spaced a distance from the first end portion and defining a second contact surface extending at the radially-outermost diameter of the bearing cage a second axial contact length. The bearing cage further includes a plurality of spanning members extending between the first and second end portions to define a spanning member axial contact length defined at the radially-outermost diameter of the bearing cage by at least one contact pad. The bearing cage produces a total contact ratio, defined as the ratio of the sum total of the first axial contact length, the second axial contact length, and the spanning member axial contact length to the overall axial length, of at least 0.380.

Abstract: Disclosed are various embodiments for implementing inventory pooling for multiple merchants. A first inventory of an item held at a first fulfillment center on behalf of a first merchant is contributed to a common pool of inventory. A second inventory of the item held at a second fulfillment center on behalf of a second merchant is contributed to the common pool of inventory. Fulfillment of an order placed by a customer of the first merchant is initiated from the second inventory of the item that was contributed by the second merchant to the common pool of inventory.

Abstract: A method and apparatus for the stabilization of the trapeziometacarpal joint following the removal or partial resection of the trapezium includes an assembly for securing a first metacarpal relative to a second metacarpal. The assembly includes a suture guide having a suture anchor plate that is frangibly connected to a guide stem.

Abstract: Disclosed are various embodiments for implementing inventory pooling for multiple merchants. A first inventory of an item held at a first fulfillment center on behalf of a first merchant is contributed to a common pool of inventory. A second inventory of the item held at a second fulfillment center on behalf of a second merchant is contributed to the common pool of inventory. Fulfillment of an order placed by a customer of the first merchant is initiated from the second inventory of the item that was contributed by the second merchant to the common pool of inventory.

Abstract: A bearing cage defines an overall axial length and includes a first end portion defining a first contact surface extending at a radially-outermost diameter of the bearing cage a first axial contact length, and a second end portion spaced a distance from the first end portion and defining a second contact surface extending at the radially-outermost diameter of the bearing cage a second axial contact length. The bearing cage further includes a plurality of spanning members extending between the first and second end portions to define a spanning member axial contact length defined at the radially-outermost diameter of the bearing cage by at least one contact pad. The bearing cage produces a total contact ratio, defined as the ratio of the sum total of the first axial contact length, the second axial contact length, and the spanning member axial contact length to the overall axial length, of at least 0.380.

Abstract: On-wafer test systems and methods for light-emitting devices, such as light-emitting diodes (LEDs), are provided. The test system may be designed, for example, to characterize the light output from the LED die (e.g., power in Lumens).

Abstract: A building safety system and method are provided that permits occupants of a building to access building safety information. The system also permits the building owner/management company to monitor and administer building safety training.

Abstract: A light-emitting device is provided. The device may include a thermally conductive region in contact with a wavelength-converting region (e.g., a phosphor region). The thermally conductive region may aid in the extraction of heat resulting from light absorption in the wavelength-converting region, which, if excessive, may impair device operation. The presence of a thermally conductive region can enable devices including wavelength-converting regions to operate even at high power levels (e.g., light generated by the light-generating region and/or by the light-emitting device having a total power greater than 0.5 Watts) for long operating lifetimes (e.g., greater than 2,000 hours).

Abstract: A method for separating a semiconductor wafer into several thousand devices or dies by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it.

Abstract: A contact for n-type III-V semiconductor such as GaN and related nitride-based semiconductors is formed by depositing Al,Ti,Pt and Au in that order on the n-type semiconductor and annealing the resulting stack, desirably at about 400-600° C. for about 1-10 minutes. The resulting contact provides a low-resistance, ohmic contact to the semiconductor and excellent bonding to gold leads.

Abstract: Light emitting diodes such as those formed from gallium nitride based semiconductors are provided with electrode and pad structures which facilitate current spreading. The LED may be formed as a die with a lower contact surface and a mesa projecting upwardly from the lower contact surface. An electrode on the lower contact surface may be in the form of a ring substantially encircling the mesa. In other arrangements, the pad and/or electrode on the lower contact surface is disposed in an indentation on one edge of the mesa whereas the pad on the top of the mesa is disposed adjacent the opposite edge of the mesa.

Abstract: A method for separating a semiconductor wafer into several thousand devices or die by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it.

Abstract: A method for separating a semiconductor wafer into several thousand devices or die by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it.

Abstract: A method of forming a self-aligned contact on a semiconductor includes forming a layer of a dielectric material over a semiconductor, providing a photoresist layer over the dielectric layer and then exposing the photoresist layer with a desired pattern and developing an opening in the photoresist layer. The dielectric material exposed through the photoresist layer opening is then removed to form a contact opening extending through the dielectric material to the semiconductor. The photoresist layer is then eroded so as to enlarge the size of the opening in the photoresist layer, whereby the dielectric material adjacent the contact opening is exposed through the enlarged opening of the photoresist layer. A barrier metal is then deposited in the enlarged opening of the photoresist layer and in the contact opening of the dielectric material, whereby the barrier metal overlies the exposed portion of the dielectric material. A conductive metal is then deposited atop the barrier metal.

Abstract: A method for separating a semiconductor wafer into several thousand devices or dies by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it.