Patents by Inventor Michael G. Harwell

Michael G. Harwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8465844
    Abstract: Hot melt adhesive compositions containing radial polystyrene-polyisoprene/polybutadiene block copolymer and use as elastic attachment adhesive in the manufacture of disposable absorbent elastic articles.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: June 18, 2013
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Michael G. Harwell
  • Patent number: 8378015
    Abstract: Hot melt adhesive compositions containing hyper-branched SBS block copolymers and end use applications thereof. The hyper-branched SBS is characterized in having a ratio between light-scattering molecular weight (of non-di-block polymer) and GPC molecular weight (of non-di-block polymer) greater than 1.4 and having ratio between light scattering molecular weight molecular weight (of non-di-block polymer) and light scattering molecular weight molecular weight (of di-block polymer) greater than 5. The ratio between light scattering molecular weight MW (of non-di-block polymer) and light scattering molecular weight MW (of di-block polymer) also defines the number of arms for the hyper branched structure. The weight average molecular weight of each arm of the hyper-branched SBS block copolymer is less than about 100,000.
    Type: Grant
    Filed: February 15, 2010
    Date of Patent: February 19, 2013
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Yuhong Hu, Alethea Pollock, Justin Mehaffy, Michael G. Harwell
  • Patent number: 7799863
    Abstract: Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275° F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: September 21, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Michael G. Harwell, Ju-ming Hung, Martin Riswick, Wei Kong, Kenneth E. Martin, Tahir Iqbal
  • Patent number: 7795341
    Abstract: Adhesives comprising up to about 40 wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: September 14, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Michael G. Harwell, Ju-ming Hung, Kenneth E. Martin, Tahir Iqbal, Sam L. Samuels
  • Patent number: 7795336
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: September 14, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Publication number: 20100210163
    Abstract: Hot melt adhesive compositions containing hyper-branched SBS block copolymers and end use applications thereof. The hyper-branched SBS is characterized in having a ratio between light-scattering molecular weight (of non-di-block polymer) and GPC molecular weight (of non-di-block polymer) greater than 1.4 and having ratio between light scattering molecular weight molecular weight (of non-di-block polymer) and light scattering molecular weight molecular weight (of di-block polymer) greater than 5. The ratio between light scattering molecular weight MW (of non-di-block polymer) and light scattering molecular weight MW (of di-block polymer) also defines the number of arms for the hyper branched structure. The weight average molecular weight of each arm of the hyper-branched SBS block copolymer is less than about 100,000.
    Type: Application
    Filed: February 15, 2010
    Publication date: August 19, 2010
    Inventors: Qiwei He, Yuhong Hu, Alethea Pollock, Justin Mehaffy, Michael G. Harwell
  • Patent number: 7683114
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: March 23, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Patent number: 7655720
    Abstract: Hot melt adhesive compositions containing radial polystyrene-polyisoprene/polybutadiene block copolymer and use as elastic attachment adhesive in the manufacture of disposable absorbent elastic articles.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: February 2, 2010
    Assignee: Henkel AG & Co. KGaA
    Inventors: Qiwei He, Michael G. Harwell
  • Patent number: 7350644
    Abstract: Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: April 1, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Michael G. Harwell, Dale L. Haner, Leisa A. Ryan
  • Publication number: 20040077240
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Application
    Filed: October 18, 2002
    Publication date: April 22, 2004
    Inventors: Charles W. Paul, Matthew L. Sharak, Leisa A. Ryan, Maria Xenidou, Michael G. Harwell, Qiwei He
  • Publication number: 20040074800
    Abstract: Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.
    Type: Application
    Filed: October 21, 2002
    Publication date: April 22, 2004
    Inventors: Michael G. Harwell, Dale L. Haner, Leisa A. Ryan