Abstract: The present invention is directed towards an electrodepositable coating composition comprising a film-forming binder and electrically conductive particles, wherein the electrically conductive particles are present in an amount of at least 25% by weight, based on the total solids weight of the electrodepositable coating composition. The present invention is also directed towards methods of coating a substrate, coatings, and coated substrates.

Abstract: The present invention is directed towards an electrodepositable coating composition comprising a film-forming binder and electrically conductive particles, wherein the electrically conductive particles are present in an amount of at least 25% by weight, based on the total solids weight of the electrodepositable coating composition. The present invention is also directed towards methods of coating a substrate, coatings, and coated substrates.

Abstract: The present invention is directed towards a coating composition comprising a film-forming polymer comprising active hydrogen-containing functional groups; a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester or thioester; and a curing catalyst that does not contain tin, lead, iron, zinc or manganese. Also disclosed are coatings, coated substrates, and methods of coating a substrate.

Abstract: Disclosed are electrodepositable coating compositions that include a cationic amine salt group-containing (meth)acrylic polymer in which the (meth)acrylic polymer is prepared by polymerizing a mixture of ethylenically unsaturated monomers comprising at least 10% by weight of a (meth)acrylic monomer containing hydroxy ester groups, the % by weight being based on total weight of ethylenically unsaturated monomers, and an acid salt of a guanidine or a guanidine reaction product. Associated methods of preparing an amine salt group containing composition and for coating a substrate are also disclosed. Substrates coated with the electrodepositable coating composition are also disclosed.

Abstract: Disclosed are electrodepositable coating compositions that include a cationic amine salt group-containing (meth)acrylic polymer in which the (meth)acrylic polymer is prepared by polymerizing a mixture of ethylenically unsaturated monomers comprising at least 10% by weight of a (meth)acrylic monomer containing hydroxy ester groups, the % by weight being based on total weight of ethylenically unsaturated monomers, and an acid salt of a guanidine or a guanidine reaction product. Associated methods of preparing an amine salt group containing composition and for coating a substrate are also disclosed. Substrates coated with the electrodepositable coating composition are also disclosed.

Abstract: The present invention relates to an electrodepositable coating composition comprising a crater control additive.

Abstract: A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.

Abstract: A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.

Abstract: A method includes: immersing a semiconductive substrate in an electrodeposition composition, wherein at least 20 percent by weight of resin solids in the composition is a highly cross-linked microgel component, and applying a voltage between the substrate and the composition to form a dielectric coating on the substrate. A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.

Abstract: The present invention relates to an electrodepositable coating composition comprising a crater control additive.

Abstract: A method includes: immersing a semiconductive substrate in an electrodeposition composition, wherein at least 20 percent by weight of resin solids in the composition is a highly cross-linked microgel component, and applying a voltage between the substrate and the composition to form a dielectric coating on the substrate. A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked migrogel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.

Abstract: Provided is a method for preparing a circuit assembly. The method includes (a) applying a curable coating composition to a substrate, the curable coating composition formed from (i) one or more active hydrogen-containing resins, (ii) one or more polyester curing agents, and (iii) optionally, one or more transesterification catalysts; (b) curing the curable coating composition to form a coating on the substrate; and (c) applying a conductive layer to the surface of at least part of said cured composition. A circuit assembly prepared by the method also is provided.

Abstract: Provided is a process for forming metallized vias in a substrate including the steps of (I) applying to an electroconductive substrate an electrodepositable coating composition onto all exposed surfaces of the substrate to form a conformal dielectric coating; (II) ablating a surface of the dielectric coating to expose a section of the substrate; (III) applying a layer of metal to all surfaces to form metallized vias in the substrate. Also disclosed are processes for fabricating a circuit assembly which include the application of an electrodoepositable coating composition onto exposed surfaces of the substrate/core to form a conformal dielectric coating thereon. The electrodepositable coating composition includes a resinous phase dispersed in an aqueous phase, where the resinous phase has a covalently bonded halogen content of at least 1 percent by weight. The dielectric coating derived therefrom has a low dielectric constant and low dielectric loss factor.

Abstract: The present invention relates to an electrodepositable coating composition having a resinous phase dispersed in an aqueous medium. The resinous phase includes (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin; and (b) a curing agent reactive with the active hydrogens of the resin (a). The resinous phase has a covalently bonded halogen content based on total weight of resin solids present in the resinous phase such that when the composition is electrodeposited and cured, the cured film passes flame resistance testing in accordance with IPC-TM-650, and has a dielectric constant of less than or equal to 3.50. The invention also is directed to a method for forming a dielectric coating on an electroconductive substrate using the electrodepositable coating composition, as well as to a substrate coated with the electrodepositable composition.

Abstract: The present invention relates to an electrodepositable coating composition having a resinous phase dispersed in an aqueous medium. The resinous phase includes (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin; and (b) a curing agent reactive with the active hydrogens of the resin (a). The resinous phase has a covalently bonded halogen content based on total weight of resin solids present in the resinous phase such that when the composition is electrodeposited and cured, the cured film passes flame resistance testing in accordance with IPC-TM-650, and has a dielectric constant of less than or equal to 3.50. The invention also is directed to a method for forming a dielectric coating on an electroconductive substrate using the electrodepositable coating composition, as well as to a substrate coated with the electrodepositable composition.

Abstract: Provided is a process for forming metallized vias in a substrate including the steps of (I) applying to an electroconductive substrate an electrodepositable coating composition onto all exposed surfaces of the substrate to form a conformal dielectric coating; (II) ablating a surface of the dielectric coating to expose a section of the substrate; (III) applying a layer of metal to all surfaces to form metallized vias in the substrate. Also disclosed are processes for fabricating a circuit assembly which include the application of an electrodoepositable coating composition onto exposed surfaces of the substrate/core to form a conformal dielectric coating thereon. The electrodepositable coating composition includes a resinous phase dispersed in an aqueous phase, where the resinous phase has a covalently bonded halogen content of at least 1 percent by weight. The dielectric coating derived therefrom has a low dielectric constant and low dielectric loss factor.

Abstract: Provided are curable coating compositions comprised of any of a variety of film-forming polymers containing reactive functional groups, a curing agent containing functional groups which are reactive with the functional groups of the polymer, and an exfoliated silicate material derived from a layered silicate which has been exfoliated with a polymer which is compatible with both the film-forming polymer and the curing agent. The inclusion of the exfoliated silicate material enhances coating properties such as adhesion, appearance, crater resistance, and rheology control.

Abstract: Provided are acidified aqueous stable dispersions of an exfoliated silicate derived from a silicate having a layer lattice structure in which the silicate layer units have a thickness of 5 to 25 Angstroms, wherein the exchange capacity ranges from 30 to 200 millequivalents per gram of silicate having a layer lattice structure, and wherein the silicate materials have been exfoliated with a cationic group-containing polymer or polymer having functional groups which can be post-reacted to form cationic groups. These silicate dispersions are useful in coating compositions, particularly in electrodepositable coating compositions, where they impart improved crater control.

Abstract: Provided are cationic electrodepositable compositions comprised of an acidified aqueous dispersion of (a) an ungelled cationic resin, (b) a curing agent having at least two functional groups which are reactive with (a), and (c) an exfoliated silicate derived from a layered silicate. These compositions exhibit improved crater control. Also provided is a method of electrocoating conductive substrates using such compositions.

Abstract: An electrodepositable photoresist composition comprising an aqueous dispersion of: (a) a water-dispersible neutralized cationic polymeric material having a pendant unsaturation, (b) a nonionic unsaturated material and (c) a photoinitiator; characterized in that it can form smooth, thin and pinhole free coatings and further characterized in that the film is capable of being selectively insolubilized by patterned radiation exposure such that the unexposed portion of the film is soluble in dilute aqueous acid and the exposed portion is insoluble in said aqueous acid.