Abstract: A van der Pauw (VDP) sensor comprising an electronic circuit electrically coupled to a surface, the surface comprising a type III-V material, and the electronic circuit measuring a sheet resistivity of the surface using a VDP technique. The VDP sensor may further comprise a macromolecule, such as a porphyrin, an oligonucleotide, a protein, a polymer or a combination thereof in contact with the surface. The VDP sensors may be arranged in an array of similar or different sensors. An electronic circuit electrically coupled to a type III-V material having a two-dimensional electron gas, such as InAs or InN, the electronic circuit measuring an electrical property of the type III-V material having a two-dimensional electron gas.

Abstract: An apparatus to fill vertical gaps between pickets. The apparatus comprising a privacy strip and a privacy tip. The privacy strip configured to occupy the vertical gaps found between at least two parallel and vertical pickets between the top stringer and the bottom stringer. The privacy tip configured to occupy the vertical gaps created above the top stringer and between at least two parallel and vertical pickets. The privacy strip is integrated into the privacy fence by inserting a first side of the privacy strip into the top of the bottom stringer, bending out, and then inserting the second side of the privacy strip into the bottom of the top stringer. The privacy tip is integrated into the privacy fence by sticking a first wedge side into the top stringer.

Abstract: An apparatus to fill vertical gaps between pickets. The apparatus comprising a privacy strip and a privacy tip. The privacy strip configured to occupy the vertical gaps found between at least two parallel and vertical pickets between the top stringer and the bottom stringer. The privacy tip configured to occupy the vertical gaps created above the top stringer and between at least two parallel and vertical pickets. The privacy strip is integrated into the privacy fence by inserting a first side of the privacy strip into the top of the bottom stringer, bending out, and then inserting the second side of the privacy strip into the bottom of the top stringer. The privacy tip is integrated into the privacy fence by sticking a first wedge side into the top stringer.

Abstract: Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.

Abstract: A head-mounted display (HMD) system includes an HMD device wearable upon a head of a user, and a peripheral device that is dockable with the HMD device. The peripheral device comprises a plurality of light source elements disposed along a perimeter of a face of the peripheral device and a peripheral electronic control system. The peripheral electronic control system is configured to form an optically detectable light pattern with the plurality of light source elements by controlling each of the light source elements. The HMD device is configured to detect the optically detectable light pattern with a camera and to display an augmented reality (AR) content based on the identified optically detectable light pattern.

Abstract: A head-mounted display (HMD) system includes an HMD device wearable upon a head of a user, and a peripheral device that is dockable with the HMD device via a pair of electronic connectors. The HMD device and the peripheral device may communicate with each other via wireless communications in a docked configuration, and may communicate with each other via wired communications over the pair of electronic connectors in the docked configuration. The HMD system supports a variety of different modes of operation that may be varied responsive to whether the peripheral device is in the docked configuration or the undocked configuration with the HMD device.

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.

Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

Abstract: Systems and methods for providing a searchable platform for online content. Online content may be obtained over a network. The online content may have existing metadata associated with the online content. The existing metadata may include platform information related to distribution of the online content through the online content distribution platform, file information related to an electronic file that defines the online content, and/or other information. The existing metadata associated with the online content may be processed such that the existing metadata is searchable. Supplemental metadata for the online content may be obtained. The supplemental metadata may be associated with the online content. The supplemental metadata may include one or more of platform information, file information, content information, contextual information, and/or other information. A search query may be received and a result may be generated based the existing metadata and/or the supplemental metadata.

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Abstract: A technique for reducing altitude error involves determining a corrected altitude for an aircraft using forecast atmospheric pressure data available, for example, from a weather forecasting service. The forecast atmospheric pressure data includes, for a number of points in time and for a number of geographic locations, a set of pressure levels and corresponding altitude values. Altitude correction data is periodically calculated from the forecast atmospheric pressure data for each of a number of geographic grid points. Upon receiving aircraft position information and an aircraft altitude measurement for an aircraft, one or more of the geographic grid points corresponding to the aircraft position are identified, and a corrected altitude of the aircraft is determined based on the altitude correction data of the one or more geographic grid points.

Abstract: A head mounted device includes a helmet with a guide, a lens frame, at least one display surface mounted to the lens frame. The guide extends from a cavity of the helmet. The lens frame is moveably connected to the guide and moves along an axis of the guide between a first position within the cavity of the helmet and a second position outside the cavity of the helmet. The display surface is transparent and configured to display augmented reality content.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

Abstract: A computer simulates flight routes for simulated airborne transmitters across a spatial region divided into unit area tiles and over time based on actual aircraft flight plan data. The computer determines transmitter counts per tile per time interval based on the flight routes and assigns transmit parameters, including transmit message rates, to the transmitters. The computer determines transmit message rates per tile based on the transmitter counts and the transmit parameters. The computer generates, for a simulated receiver, an antenna pattern covering at least some of the tiles, and converts the transmit message rates of the covered tiles to a total effective receive message rate of interfering messages at the receiver. The computer determines a probability of successful detection of a desired message among the interfering messages at the receiver based on the effective receive message rate.