Patents by Inventor Michael Gardner

Michael Gardner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die for a printhead
    Patent number: 11345145
    Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: May 31, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, Scott A. Linn, James Michael Gardner
  • Logic circuitry package
    Patent number: 11345157
    Abstract: A logic circuitry package for a replaceable print apparatus component comprises at least one logic circuit and an interface to communicate with a print apparatus logic circuit. The at least one logic circuit is configured to receive, via the interface, calibration parameters including an offset parameter and a sensor ID. The at least one logic circuit is configured to output, via the interface, a digital value corresponding to the sensor ID and offset based on the offset parameter.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 31, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sirena Lu, Rogelio Cicili, James Michael Gardner, Scott A. Linn
  • Logic circuitry
    Patent number: 11338586
    Abstract: This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: May 24, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, Quinton B. Weaver, David N. Olsen, James Michael Gardner, James William Ring, David Owen Roethig, Christopher Hans Bakker
  • Logic circuitry
    Patent number: 11331925
    Abstract: A sensor circuit for a replaceable print apparatus component comprises an interface to transmit signals with respect to a print apparatus logic circuit, and further comprises, connected to the interface, at least two sensor cell arrays, each array including nominally the same cells, the cells of one array being nominally different than the cells of the other array, and at least one single cell sensor that is nominally different than the other cells.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, Jefferson P. Ward, David N. Olsen, Anthony D. Studer, Michael W. Cumbie, Sirena Chi Lu
  • Thermal zone selection with a circular shift register
    Patent number: 11331909
    Abstract: Examples of a fluidic die for thermal zone selection with a circular shift register are described herein. In some examples, the fluidic die includes multiple thermal zones. Each thermal zone includes a temperature sensor and a fluidic actuator. The fluidic die also includes shared thermal control circuitry to process an output of the temperature sensor of a selected thermal zone. The fluidic die further includes a circular shift register that includes multiple memory elements. Each memory element is associated with one thermal zone. A token circulates within the circular shift register to select one thermal zone at a time for processing by the shared thermal control circuitry.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, Eric T. Martin, James Michael Gardner
  • Logic circuitry package
    Patent number: 11331924
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit includes a memory storing at least one temperature calculation parameter. The at least one logic circuit is configured to receive, via the interface, a first request to read the at least one temperature calculation parameter; and transmit, via the interface, the at least one temperature calculation parameter in response to the first request. The at least one logic circuit is configured to receive, via the interface, a second request corresponding to a sensor ID; and transmit, via the interface, a digital value in response to the second request. The digital value adjusted based on the at least one temperature calculation parameter corresponds to an absolute temperature of the print apparatus component.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn
  • Logic circuitry package
    Patent number: 11318752
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an analog sensor cell block with a plurality of sensor cells, analog control circuitry to bias and control the analog sensor cell block, an interface to communicate with a print apparatus logic circuit, a dedicated bit field that indicates whether the logic circuitry package is in a power saving mode, and at least one logic circuit. The at least one logic circuit may be configured to receive, via the interface, a request to cause the analog sensor cell block to provide sensor information for at least one sensor measurement; and selectively enable and disable power to the analog control circuitry based on the request and a value of the dedicated bit field.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 3, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn
  • LOGIC CIRCUITRY
    Publication number: 20220129570
    Abstract: In an example, a method comprises, by logic circuitry associated with a replaceable print apparatus component, responding to a first validation request sent via an I2C bus to a first address associated with the logic circuitry with a first validation response; and responding to a second validation request sent via the I2C bus to a second address associated with the logic circuitry with a second validation response.
    Type: Application
    Filed: January 5, 2022
    Publication date: April 28, 2022
    Inventors: James Michael GARDNER, Scott A. LINN, Stephen D. PANSHIN, Jefferson P. WARD, David Owen ROETHIG
  • Logic circuitry package
    Patent number: 11312145
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit is configured to receive, via the interface, a request and a reference clock signal. The at least one logic circuit is configured to transmit, via the interface, a digital value indicating a count in response to the request and the reference clock signal. The digital value varies based on the reference clock signal.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: April 26, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner
  • Logic circuitry package
    Patent number: 11312146
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and at least one logic circuit to receive, via the interface, requests corresponding to different sensor IDs with the component connected to the apparatus. The logic circuit is to transmit, via the interface, a digital value in response to each request. The digital values corresponding to the different sensor IDs are distinct.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: April 26, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Quinton B. Weaver, James Michael Gardner, David N. Olsen, Anthony D. Studer
  • Printing agent containers
    Patent number: 11298949
    Abstract: It is disclosed a printing agent container having ink an authenticity detection mechanisms comprising: a receptacle having a top wall a bottom wall opposing such top wall and a sidewall between such top wall and such bottom wall; an internal volume defined by such receptacle that contains a printing agent, and a vibration transducer on one of the side walls, wherein the container is to be mechanically coupled to a carriage so that the printing fluid is disposed on the bottom surface, being the vibration transducer to detect a vibration signal induced by the carriage and wherein the container comprises a communication channel to a controller being the controller to receive through the communication channel a container signature from the vibration transducer and to identify a container identification signal associated to the container signature.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: April 12, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, James Michael Gardner
  • Print material level sensing
    Patent number: 11292264
    Abstract: A print material level sensor includes a series of print material level sensing devices disposed at intervals to detect the presence of print material at successive depth zones in a container. Each print material level sensing device includes a heater to emit heat at its depth zone and a sensor to sense heat at the depth zone and to output a signal based on the heat sensed. The print material level sensor includes control circuitry to enable supply of electrical power to the heater of any one of the print material level sensing devices in its depth zone and to receive the signal from the respective sensor. The control circuitry includes a comparator to compare a value of the signal to a target value. The control circuitry disables supply of the electrical power to the heater when the value of the signal is at least equal to the target value.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E Anderson, James Michael Gardner
  • Print material level sensing
    Patent number: 11285729
    Abstract: A print material level sensor includes a power node to receive electrical power and a series of print material level sensing devices to receive electrical power from the power node. The print material level sensing devices are disposed at intervals to detect the presence of a print material at successive depth zones in a container. Each print material level sensing device includes a heater to emit heat at its depth zone and a sensor to sense heat at the depth zone. The sensor has control circuitry to turn on the heater of a first print material level sensing device at a first depth zone for a first time duration during the sensing of the first depth zone and to turn on the heater of a second print material level sensing device at a second depth zone for a second time duration during the sensing of the second depth zone.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: March 29, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Daryl E Anderson, Evan Clay Dagg
  • Servicing based on impedance values
    Patent number: 11279131
    Abstract: A fluid ejection system may include a fluidic die comprising at least one fluid ejection device, at least one electrical impedance sensor to detect at least one impedance value during a plurality of stages of existence of a drive bubble in at least one firing chamber associated with the at least one fluid ejection device, and a service station wherein, based on the impedance values detected, the printing system services the at least one fluid actuator.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, Eric Martin, James Michael Gardner, Jordan Morris
  • INTEGRATED CIRCUITS INCLUDING STRAIN GAUGE SENSORS
    Publication number: 20220080735
    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a strain gauge sensor, an amplifier, and a voltage bias generator. The strain gauge sensor generates a strain gauge signal. The amplifier amplifies the strain gauge signal. The voltage bias generator offsets the amplified strain gauge signal.
    Type: Application
    Filed: May 15, 2019
    Publication date: March 17, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, John Rossi
  • LOGIC CIRCUITRY PACKAGE
    Publication number: 20220080738
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and at least one logic circuit to receive, via the interface, requests corresponding to different sensor IDs with the component connected to the apparatus. The logic circuit is to transmit, via the interface, a digital value in response to each request. The digital values corresponding to the different sensor IDs are distinct.
    Type: Application
    Filed: October 25, 2019
    Publication date: March 17, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Quinton B. WEAVER, James Michael GARDNER, David N. OLSEN, Anthony D. STUDER
  • Fluidic dies
    Patent number: 11273634
    Abstract: A fluidic die may include at least two zones, a reference temperature sensor communicatively coupled to each zone, a calibration voltage generator coupled between the zones and the reference temperature sensor, and a calibration loop circuit associated with each zone to calibrate each zone based on a voltage provided by the reference temperature sensor.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: March 15, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, Eric Martin, James Michael Gardner
  • Die for a printhead
    Patent number: 11267243
    Abstract: A die for a printhead is described herein. The die includes fluid feed holes disposed in a line parallel to a longitudinal axis of the die. The fluid feed holes are formed through a substrate of the die. Fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Field-effect transistors are parallel to the fluid feed holes. Each fluidic actuator is powered by an associated field effect transistor. Logic circuitry to actuate the field-effect transistors is disposed on an opposite side of the fluid feed holes from the field-effect transistors. Traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure including one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: March 8, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Anthony M. Fuller, Michael W. Cumbie
  • Pulldown devices
    Patent number: 11260657
    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a contact pad and a programmable pulldown device. The programmable pulldown device is electrically coupled to the contact pad. The programmable pulldown device is settable to any one of a plurality of resistances.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: March 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, George H. Corrigan
  • Setpoint registers to adjust firing pulses
    Patent number: 11260656
    Abstract: A fluidic die that includes at least one temperature sensor coupled to at least one zone of the fluidic die, a setpoint register to receive a target temperature setpoint for the fluidic die wherein a detected temperature presented by the at least one temperature sensor is compared to the target temperature setpoint using a comparator module to get a firing pulse adjustment value, and a firing pulse used to convey an amount of fluid within the die is adjusted using the firing pulse adjustment value.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Daryl E. Anderson, Eric Martin