Patents by Inventor Michael Garter

Michael Garter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210217790
    Abstract: A direct bonding method for infrared focal plane arrays, includes steps of depositing a thin adhesion layer on infrared radiation detecting material, removing a portion of the thin adhesion layer with a chemical-mechanical polishing process, forming a bonding layer at a bonding interface, and bonding the infrared radiation detecting material to a silicon wafer with the thin adhesion layer as a bonding layer. The thin adhesion layer may include SiOx, where x ranges between 1.0 and 2.0. The thickness of the thin adhesion layer to form the bonding layer is 500 angstrom or less.
    Type: Application
    Filed: March 9, 2021
    Publication date: July 15, 2021
    Applicant: L3 Cincinnati Electronics Corporation
    Inventors: Steven ALLEN, Michael GARTER, Robert JONES, Joseph MEINERS, Yajun WEI, Darrel ENDRES
  • Patent number: 10978508
    Abstract: A direct bonding method for infrared focal plane arrays, includes steps of depositing a thin adhesion layer on infrared radiation detecting material, removing a portion of the thin adhesion layer with a chemical-mechanical polishing process, forming a bonding layer at a bonding interface, and bonding the infrared radiation detecting material to a silicon wafer with the thin adhesion layer as a bonding layer. The thin adhesion layer may include SiOx, where x ranges between 1.0 and 2.0. The thickness of the thin adhesion layer to form the bonding layer is 500 angstrom or less.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: April 13, 2021
    Assignee: L3 CINCINNATI ELECTRONICS CORPORATION
    Inventors: Steven Allen, Michael Garter, Robert Jones, Joseph Meiners, Yajun Wei, Darrel Endres
  • Publication number: 20210082991
    Abstract: Multicolor, stacked detector devices, focal plane arrays including multicolor, stacked detector devices, and methods of fabricating the same are disclosed. In one embodiment, a stacked multicolor detector device includes a first detector and a second detector. The first detector includes a first detector structure and a first ground plane adjacent the first detector structure. The second detector includes a second detector structure and a second ground plane adjacent the second detector structure. At least one of the first ground plane and the second ground plane is transmissive to radiation in a predetermined spectral band. The first detector and the second detector are in a stacked relationship.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 18, 2021
    Applicant: L3 CINCINNATI ELECTRONICS CORPORATION
    Inventors: Daniel Chmielewski, Yajun Wei, Nansheng Tang, Darrel Endres, Michael Garter, Mark Greiner
  • Publication number: 20210082992
    Abstract: Methods of fabricating multicolor, stacked detector devices and focal plane arrays are disclosed. In one embodiment, a method of fabricating a stacked multicolor device includes forming a first detector by depositing a first detector structure on a first detector substrate, and depositing a first ground plane on the first detector structure, wherein the first ground plane is transmissive to radiation in a predetermined spectral band. The method further includes bonding an optical carrier wafer to the first ground plane, removing the first detector substrate, and forming a second detector. The second detector is formed by depositing a second detector structure on a second detector substrate, and depositing a second ground plane on the second detector structure. The method further includes depositing a dielectric layer on one of the first detector structure and the second ground plane, bonding the first detector to the second detector, and removing the second detector substrate.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 18, 2021
    Applicant: L3 CINCINNATI ELECTRONICS CORPORATION
    Inventors: Yajun Wei, Daniel Chmielewski, Nansheng Tang, Darrel Endres, Michael Garter, Mark Greiner
  • Patent number: 10886325
    Abstract: Focal plane arrays and infrared detector device having a transparent common ground structure and methods of their fabrication are disclosed. In one embodiment, a front-side illuminated infrared detector device includes a contact layer and a detector structure adjacent to the contact layer. The detector structure is capable of absorbing radiation. The front-side illuminated infrared detector device further includes a common ground structure adjacent the detector structure, wherein the common ground structure is transmissive to radiation having a wavelength in a predetermined spectral band, and the common ground structure has a bandgap that is wider than a bandgap of the detector structure. The front-side illuminated infrared detector device further includes an optical layer adjacent the common ground structure.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: January 5, 2021
    Assignee: L3 CINCINNATI ELECTRONICS CORPORATION
    Inventors: Yajun Wei, Steven Allen, Michael Garter, Mark Greiner, David Forrai, Darrel Endres, Robert Jones
  • Patent number: 10714531
    Abstract: Focal plane arrays and infrared detector device having a transparent common ground structure and methods of their fabrication are disclosed. In one embodiment, a front-side illuminated infrared detector device includes a contact layer and a detector structure adjacent to the contact layer. The detector structure is capable of absorbing radiation. The front-side illuminated infrared detector device further includes a common ground structure adjacent the detector structure, wherein the common ground structure is transmissive to radiation having a wavelength in a predetermined spectral band, and the common ground structure has a bandgap that is wider than a bandgap of the detector structure. The front-side illuminated infrared detector device further includes an optical layer adjacent the common ground structure.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: July 14, 2020
    Assignee: L3 Cincinnati Electronics Corporation
    Inventors: Yajun Wei, Steven Allen, Michael Garter, Mark Greiner, David Forrai, Darrel Endres
  • Publication number: 20200119063
    Abstract: A direct bonding method for infrared focal plane arrays, includes steps of depositing a thin adhesion layer on infrared radiation detecting material, removing a portion of the thin adhesion layer with a chemical-mechanical polishing process, forming a bonding layer at a bonding interface, and bonding the infrared radiation detecting material to a silicon wafer with the thin adhesion layer as a bonding layer. The thin adhesion layer may include SiOx, where x ranges between 1.0 and 2.0. The thickness of the thin adhesion layer to form the bonding layer is 500 angstrom or less.
    Type: Application
    Filed: October 16, 2019
    Publication date: April 16, 2020
    Inventors: Steven ALLEN, Michael GARTER, Robert JONES, Joseph MEINERS, Yajun WEI, Darrel ENDRES
  • Publication number: 20180294301
    Abstract: Focal plane arrays and infrared detector device having a transparent common ground structure and methods of their fabrication are disclosed. In one embodiment, a front-side illuminated infrared detector device includes a contact layer and a detector structure adjacent to the contact layer. The detector structure is capable of absorbing radiation. The front-side illuminated infrared detector device further includes a common ground structure adjacent the detector structure, wherein the common ground structure is transmissive to radiation having a wavelength is a predetermined spectral band, and the common ground structure has a bandgap that is wider than a bandgap of the detector structure. The front-side illuminated infrared detector device further includes an optical layer adjacent the common ground structure.
    Type: Application
    Filed: May 4, 2018
    Publication date: October 11, 2018
    Applicant: L3 Cincinnati Electronics Corporation
    Inventors: Yajun Wei, Steven Allen, Michael Garter, Mark Greiner, David Forrai, Darrel Endres, Robert Jones
  • Publication number: 20180294309
    Abstract: Focal plane arrays and infrared detector device having a transparent common ground structure and methods of their fabrication are disclosed. In one embodiment, a front-side illuminated infrared detector device includes a contact layer and a detector structure adjacent to the contact layer. The detector structure is capable of absorbing radiation. The front-side illuminated infrared detector device further includes a common ground structure adjacent the detector structure, wherein the common ground structure is transmissive to radiation having a wavelength is a predetermined spectral band, and the common ground structure has a bandgap that is wider than a bandgap of the detector structure. The front-side illuminated infrared detector device further includes an optical layer adjacent the common ground structure.
    Type: Application
    Filed: May 4, 2018
    Publication date: October 11, 2018
    Applicant: L3 Cincinnati Electronics Corporation
    Inventors: Yajun Wei, Steven Allen, Michael Garter, Mark Greiner, David Forrai, Darrel Endres