Patents by Inventor Michael Gasvoda

Michael Gasvoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
    Patent number: 9645097
    Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: May 9, 2017
    Assignee: KLA-Tencor Corporation
    Inventors: Lena Nicolaides, Ben-ming Benjamin Tsai, Prashant A. Aji, Michael Gasvoda, Stanley E. Stokowski, Guoheng Zhao, Youxian Wen, Mohan Mahadevan, Paul D. Horn, Wolfgang Vollrath, Isabella T. Lewis
  • IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING
    Publication number: 20150370175
    Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.
    Type: Application
    Filed: June 17, 2015
    Publication date: December 24, 2015
    Applicant: KLA-Tencor Corporation
    Inventors: Lena Nicolaides, Ben-ming Benjamin Tsai, Prashant A. Aji, Michael Gasvoda, Stanley E. Stokowski, Guoheng Zhao, Youxian Wen, Mohan Mahadevan, Paul D. Horn, Wolfgang Vollrath, Isabella T. Lewis