Patents by Inventor Michael Gaynes
Michael Gaynes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7079393Abstract: A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.Type: GrantFiled: November 16, 2004Date of Patent: July 18, 2006Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman, David L. Edwards, Michael A. Gaynes, Mukta G. Farooq, Sung K. Kang, Steven P. Ostrander, Jaimal M. Williamson, Da-Yuan Shih, Donald W. Henderson
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Patent number: 7078802Abstract: A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).Type: GrantFiled: November 8, 2004Date of Patent: July 18, 2006Assignee: International Business Machines CorporationInventors: Michael Gaynes, William R. Hill
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Patent number: 7064013Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: GrantFiled: July 1, 2004Date of Patent: June 20, 2006Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Publication number: 20060104031Abstract: A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.Type: ApplicationFiled: November 16, 2004Publication date: May 18, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan Colgan, Frank Pompeo, Glenn Daves, Hilton Toy, Bruce Furman, David Edwards, Michael Gaynes, Mukta Farooq, Sung Kang, Steven Ostrander, Jaimal Williamson, Da-Yuan Shih, Donald Henderson
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Publication number: 20060057867Abstract: A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.Type: ApplicationFiled: October 28, 2005Publication date: March 16, 2006Applicant: International Business Machines CorporationInventors: William Brodsky, William Buchler, Benson Chan, Michael Gaynes
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Patent number: 6984286Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.Type: GrantFiled: January 8, 2003Date of Patent: January 10, 2006Assignee: International Business Machines CorporationInventors: Barry A. Bonitz, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson
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Patent number: 6981880Abstract: A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.Type: GrantFiled: June 22, 2004Date of Patent: January 3, 2006Assignee: International Business Machines CorporationInventors: William L. Brodsky, William E. Buchler, Jr., Benson Chan, Michael A. Gaynes
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Publication number: 20050282409Abstract: A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an electronic module and electrical contacts on a substrate, each hold, for example, a resilient wadded wire connector. Each connector extends through the aperture provided and beyond the upper and lower surfaces of the carrier layer. Each resilient wadded wire connector and aperture is encapsulated with a elastomeric insulating material sufficiently deformable so as to allow said resilient wadded wire connector to deform upon application of a normal force from each side tending to depress the connector into its aperture. The encapsulation prevents loss or smear of a wadded wire connector when handling.Type: ApplicationFiled: June 22, 2004Publication date: December 22, 2005Applicant: International Business Machines CorporationInventors: William Brodsky, William Buchler, Benson Chan, Michael Gaynes
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Publication number: 20050241731Abstract: The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.Type: ApplicationFiled: April 28, 2004Publication date: November 3, 2005Applicant: International Business Machines CorporationInventors: Eric Duchesne, Michael Gaynes, Timothy Gosselin, Kang-Wook Lee, Valerie Oberson
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Patent number: 6949415Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.Type: GrantFiled: February 26, 2004Date of Patent: September 27, 2005Assignee: International Business Machines CorporationInventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman
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Patent number: 6893523Abstract: A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).Type: GrantFiled: February 28, 2002Date of Patent: May 17, 2005Assignee: International Business Machines CorporationInventors: Michael Gaynes, William R. Hill
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Patent number: 6893591Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.Type: GrantFiled: July 10, 2002Date of Patent: May 17, 2005Assignee: International Business Machines CorporationInventors: John G. Davis, Michael A. Gaynes, Joseph D. Poole
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Publication number: 20050062154Abstract: Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel method for the adhesive fastening of metallic heat spreaders to semiconductor chips through the combined use of electrically conductive and non-conductive adhesive materials.Type: ApplicationFiled: September 18, 2003Publication date: March 24, 2005Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eric Duchesne, Michael Gaynes
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Publication number: 20050064106Abstract: A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).Type: ApplicationFiled: November 8, 2004Publication date: March 24, 2005Applicant: International Business Machines CorporationInventors: Michael Gaynes, William Hill
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Publication number: 20050064740Abstract: The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.Type: ApplicationFiled: November 1, 2004Publication date: March 24, 2005Applicant: International Business Machines CorporationInventors: William Brodsky, Benson Chan, Michael Gaynes, Voya Markovich
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Publication number: 20050051927Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.Type: ApplicationFiled: August 11, 2004Publication date: March 10, 2005Inventors: John Davis, Michael Gaynes, Joseph Poole
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Patent number: 6835441Abstract: Two surfaces are adhesively bonded together by providing on one of the surfaces a central, single point adhesive contact deposit and providing on one of the surfaces, adhesive extending from a central point deposit in a spoke-like array diagonally across substantially the entire surface. Also provided is the article obtained by the above method as well as the assembly used for bonding the two surfaces together. The surfaces are brought together, one on top of the other, with the adhesive located between the surfaces to cause the adhesive to spread out and cover the surfaces to thereby bond them together.Type: GrantFiled: June 15, 2000Date of Patent: December 28, 2004Assignee: International Business Machines CorporationInventors: Michael A. Gaynes, Ramesh R. Kodnani
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Publication number: 20040238967Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: ApplicationFiled: July 1, 2004Publication date: December 2, 2004Inventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Patent number: 6803256Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: GrantFiled: January 4, 2002Date of Patent: October 12, 2004Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Publication number: 20040164401Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.Type: ApplicationFiled: February 26, 2004Publication date: August 26, 2004Inventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman