Abstract: The embodiments relate to an infrared sensor having a microstructure with a plurality of thermocouples and a carrier element, wherein each thermocouple of the plurality of thermocouples includes a first sensor element having a first Seebeck coefficient and a second sensor element having a second Seebeck coefficient, wherein the first and the second sensor element extend from a front side of the carrier element through the carrier element to a rear side of the carrier element and wherein the first and the second sensor element are electrically connected to one another in a region of the upper side of the carrier element, wherein the carrier element forms a substrate for an integrated circuit, which is configured on the rear side of the carrier element and includes at least one component which is electrically connected to the first the second sensor element.