Abstract: The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.

Abstract: A device for laminating a substrate with a thermoplastic coating material has an IR heating device for melting a surface of the coating material, an opposite cooling apparatus which actively cools the opposite surface of the coating material, and at least one press-roller assembly, which presses together the substrate web and the coating material to produce a hot-melt adhesive bond. In order to prevent any irregularities in the finished product, the cooling apparatus is designed as a rotatably driven cooling roller, over the circumference of which the following are arranged in succession: a feed apparatus for the thermoplastic coating material, one or more IR radiant heaters for heating the surface of the thermoplastic coating material resting on the cooling roller, a feed apparatus for the substrate web, one or more press rollers for pressing the substrate web against the coating material, and a removal apparatus for the laminated product.

Abstract: The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.

Abstract: The invention relates to a method for adhering flexible substrates, the connecting adhesive layer being formed in a thin manner. The invention further relates to a composite substrate, wherein the two substrates are connected by a thin flexible adhesive layer.

Abstract: A device for laminating a substrate with a thermoplastic coating material has an IR heating device for melting a surface of the coating material, an opposite cooling apparatus which actively cools the opposite surface of the coating material, and at least one press-roller assembly, which presses together the substrate web and the coating material to produce a hot-melt adhesive bond. In order to prevent any irregularities in the finished product, the cooling apparatus is designed as a rotatably driven cooling roller, over the circumference of which the following are arranged in succession: a feed apparatus for the thermoplastic coating material, one or more IR radiant heaters for heating the surface of the thermoplastic coating material resting on the cooling roller, a feed apparatus for the substrate web, one or more press rollers for pressing the substrate web against the coating material, and a removal apparatus for the laminated product.

Abstract: The invention relates to: a method for adhesively bonding two substrates, in which a first substrate, which contains a thermoplastic, is transported by way of at least one supporting conveyor belt through a heating zone in which the surface of said substrate is softened, and then the second substrate, which has an adhesive layer, is laminated onto the softened surface of the first substrate and pressed together therewith; a composite body obtainable in this manner, in which the two substrates are bonded by a flexible, thin adhesive layer; and a device for adhesively bonding these two substrates by means of the described method.

Abstract: The invention relates to: a method for adhesively bonding two substrates, in which a first substrate, which contains a thermoplastic, is transported by way of at least one supporting conveyor belt through a heating zone in which the surface of said substrate is softened, and then the second substrate, which has an adhesive layer, is laminated onto the softened surface of the first substrate and pressed together therewith; a composite body obtainable in this manner, in which the two substrates are bonded by a flexible, thin adhesive layer; and a device for adhesively bonding these two substrates by means of the described method.

Abstract: The invention relates to a method for adhering flexible substrates, the connecting adhesive layer being formed in a thin manner. The invention further relates to a composite substrate, wherein the two substrates are connected by a thin flexible adhesive layer.