Abstract: A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1?) and application of a dielectric insulating foil (3, 3?) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4?) to the insulating layer (3, 3?); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1?) plus insulating layer (3, 3?) and conducting paths (4, 4?) by interposing a prepreg layer (5, 85; 18, 18?), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.

Abstract: A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1?) and application of a dielectric insulating foil (3, 3?) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4?) to the insulating layer (3, 3?); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1?) plus insulating layer (3, 3?) and conducting paths (4, 4?) by interposing a prepreg layer (5, 85; 18, 18?), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.