Abstract: A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.

Abstract: An emergency locator apparatus includes a transceiver configured to periodically send and receive communications with a plurality of other emergency locator apparatus including a target emergency locator apparatus using an ad-hoc wireless local area network. A processor is operably coupled to the transceiver and configured to determine location information of the target emergency locator apparatus utilizing at least context information associated with the communications received from at least a subset of the plurality of other emergency locator apparatus over the ad-hoc wireless local area network. A display is configured to display the location information determined by the processor.

Abstract: A wireless backhaul system including a terminal is disclosed. The system includes a network interface that is configured to send and receive data over a wide area network. A control module is coupled to the network interface and configured to generate electromagnetic energy. An antenna assembly is coupled to the control module and the network interface. The antenna assembly includes a high speed-high bandwidth (HSHB) antenna configured to wirelessly emit millimeter wave electromagnetic energy signals to a target terminal. A gimbal assembly is coupled to the antenna assembly and the control module. The gimbal assembly is configured to selectively position the antenna assembly to azimuth and elevation coordinates selected by the control module to establish and maintain a HSHB data communication link with the target terminal using the millimeter wave electromagnetic energy signals.

Abstract: An emergency locator apparatus includes a transceiver configured to periodically send and receive communications with a plurality of other emergency locator apparatus including a target emergency locator apparatus using an ad-hoc wireless local area network. A processor is operably coupled to the transceiver and configured to determine location information of the target emergency locator apparatus utilizing at least context information associated with the communications received from at least a subset of the plurality of other emergency locator apparatus over the ad-hoc wireless local area network. A display is configured to display the location information determined by the processor.

Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.

Abstract: A system and method of wirelessly communicating in a backplane mesh network is disclosed. A data message received from a first network device is handled at a first antenna system located in a first network device cabinet via a first network interface. The data message is wirelessly transmitted from a first millimeter wave antenna coupled to the first antenna system over a high speed backplane network to a second network device in a second device cabinet using emitted millimeter wave electromagnetic radiation. The data message is wirelessly received at a second millimeter wave antenna over the high speed backplane network using emitted millimeter wave electromagnetic radiation, wherein the received data message is handled by a second antenna system coupled to the second millimeter wave antenna. The received data message is sent, via a second network interface, from the second antenna system to the second network device.

Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.

Abstract: A system and method including deriving a subcarrier frequency from a binary data stream having a clock frequency, wherein the subcarrier frequency is substantially the same as the clock frequency; gating the subcarrier frequency using the data stream to produce a modulated OOK signal; determining a OOK subcarrier center frequency based on the modulated OOK signal with the clock frequency; delaying the modulated OOK signal relative to the binary data stream by a predetermined amount to produce a delayed modulated OOK signal; conditioning the modulated OOK signal and the delayed modulated OOK signal to create a differential transition signal in an I channel and a Q channel to provide a stable amplitude signal level reference at an input to an I and Q vector modulator.

Abstract: A waveguide interface and a method of manufacturing is disclosed. The interface includes a support block that has a printed circuit board. A communication device is coupled to the circuit board. A launch transducer is positioned adjacent to and coupled to the communication device. The launch transducer includes one or more transmission lines in a first portion and at least one antenna element in a second portion. The antenna element radiates millimeter wave frequency signals. An interface plate coupled to the support block has a rectangular slot having predetermined dimensions. A waveguide component is coupled to the interface plate and has a waveguide opening. The first portion of the launch transducer is positioned within the slot such that the slot prevents energy from the transmission line from emitting toward the circuit board or the waveguide opening but allows energy to pass from the antenna element into the waveguide opening.

Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.

Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.

Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.

Abstract: A full-wave di-patch antenna having two half-wave patch antennas located such that the feed points are facing one another and are brought out to a balanced transmission line having two conductors of microstrip feed lines. The phase of the current and the voltage is inverted 180 degrees between the two patches relative to the mechanical structure. The physical spacing of the two patches from center-to-center is one guide wavelength long. The two patches are disposed on a dielectric substrate which is in turn disposed over a ground plane. The two patches can take any of a number of shapes including a rectangle.

Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.

Abstract: A system and method for encoding and decoding information by use of radio frequency antennas. The system includes one or more interrogator devices and RFID data tags. The RFID data tags include a plurality of antenna elements which are formed on a substrate or directly on an object. The antenna elements are oriented and have dimensions to provide polarization and phase information, whereby this information represents the encoded information on the RFID tag. The interrogator device scans an area and uses radar imaging technology to create an image of a scanned area. The device receives re-radiated RF signals from the antenna elements on the data tags, whereby the data tags are preferably represented on the image. The re-radiated RF signals preferably include polarization and phase information of each antenna element, whereby the information is utilized using radar signal imaging algorithms to decode the information on the RF data tag.

Abstract: An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.

Abstract: A system and method for encoding and decoding information by use of radio frequency antennas. The system includes one or more interrogator devices and RFID data tags. The RFID data tags include a plurality of antenna elements which are formed on a substrate or directly on an object. The antenna elements are oriented and have dimensions to provide polarization and phase information, whereby this information represents the encoded information on the RFID tag. The interrogator device scans an area and uses radar imaging technology to create an image of a scanned area. The device receives re-radiated RF signals from the antenna elements on the data tags, whereby the data tags are preferably represented on the image. The re-radiated RF signals preferably include polarization and phase information of each antenna element, whereby the information is utilized using radar signal imaging algorithms to decode the information on the RF data tag.

Abstract: A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.

Abstract: A system and method for encoding and decoding information by use of radio frequency antennas. The system includes one or more interrogator devices and RFID data tags. The RFID data tags include a plurality of antenna elements which are formed on a substrate or directly on an object. The antenna elements are oriented and have dimensions to provide polarization and phase information, whereby this information represents the encoded information on the RFID tag. The interrogator device scans an area and uses radar imaging technology to create an image of a scanned area. The device receives re-radiated RF signals from the antenna elements on the data tags, whereby the data tags are preferably represented on the image. The re-radiated RF signals preferably include polarization and phase information of each antenna element, whereby the information is utilized using radar signal imaging algorithms to decode the information on the RF data tag.

Abstract: A full-wave di-patch antenna having two half-wave patch antennas located such that the feed points are facing one another and are brought out to a balanced transmission line having two conductors of microstrip feed lines. The phase of the current and the voltage is inverted 180 degrees between the two patches relative to the mechanical structure. The physical spacing of the two patches from center-to-center is one guide wavelength long. The two patches are disposed on a dielectric substrate which is in turn disposed over a ground plane. The two patches can take any of a number of shapes including a rectangle.