Abstract: A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.

Abstract: A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.

Abstract: A multisection quantum dot laser (7) comprising at least first (8) and second (9) sections, each section (8, 9) comprising a semiconductor substrate (2) comprising p (3) and n type (4) layers and a quantum dot layer sandwiched therebetween; the semiconductor substrate (2) comprising a back electrical contact in electrical contact with one of the p and n type layers and a tuning electrical contact (13, 14) in electrical contact with the other of the p and n type layers; the quantum-dot layers of the first (10) and second (11) sections being portions of the same quantum dot layer (12) forming a laser cavity.

Abstract: A multisection quantum dot laser (7) comprising at least first (8) and second (9) sections, each section (8, 9) comprising a semiconductor substrate (2) comprising p (3) and n type (4) layers and a quantum dot layer sandwiched therebetween; the semiconductor substrate (2) comprising a back electrical contact in electrical contact with one of the p and n type layers and a tuning electrical contact (13, 14) in electrical contact with the other of the p and n type layers; the quantum-dot layers of the first (10) and second (11) sections being portions of the same quantum dot layer (12) forming a laser cavity.

Abstract: An assembly for high volume production of printed circuit cables consisting of: a plurality of printed circuit cables 10 cut from a polyimide base sheet 30 coated with a layer of copper and further coated with a photo-imaging material layer, wherein copper layer and photo-imaging material layer are photo-etched away at certain locations, a cover layer 34 applied on top of said printed circuit cables 10, cover layer 34 extending laterally from printed circuit cables 10, and forming tabs 16 at a plurality of locations, and a panel 20 having a plurality of apertures 15 cut therein, apertures 15 each dimensioned to receive a printed circuit cable 10 therein, and tabs 16 being connected to panel 20. A worknest 50 having certain areas 52 raised to different heights, worknest 50 adapted to be positioned under and provide support to the plurality of printed circuit cables 10. A cutting device 60 being adapted to cut tabs 16 thereby enabling printed circuit cables 10 to be removed from panel 20.