Abstract: An apparatus determines a spatial position of an audio source in multi moving audio sources scenarios. The apparatus receives audio signal versions as local sound waves. The apparatus determines first and second probabilities for a direction of arrival of the audio signal version based on the audio signal versions received within a first time interval; determines third and fourth probabilities for the direction of arrival of the audio signal version based on the audio signal versions received within a second time interval; determines a first probability difference between the first and third probabilities; determines a second probability difference between the second and fourth probabilities; combines the third probability and the first probability difference to obtain an updated third probability; combines the fourth probability with the second probability difference to obtain an updated fourth probability; and determines the spatial position based on the updated third and fourth probabilities.

Abstract: Example methods and apparatuses are disclosed for providing tissue ablation through electrolysis, electroporation, or a combination thereof. A way to deliver the combination through a pulse that has an element of gradual decay and can thereby reduce both muscle contraction and electric breakdown discharge at the electrodes is disclosed. The apparatus disclosed may include an electrode, a power supply, and a controller. The controller may control a charge applied to the electrode to induce a direct current through a treatment site to produce electrolysis products and a voltage to produce electroporation. The duration and magnitude of the charge applied may determine the dose of the products and the degree of the permeabilization of cells in the treatment site.

Abstract: A gearbox actuator unit (14) is configured to be arranged on a gearbox (10) and includes a housing (22), a control device (24), and an actuator (28, 30). The housing (22) is configured to attach to a gearbox housing (12) and to seal the gearbox housing (12). The control device (24) is electrically connected to the actuator (28, 30) and activates the actuator (28, 30). A pinon of the actuator (28, 30) is configured to actuate a rack of a shift fork (18, 20) of the gearbox (10) and can be connected to the shift fork (18, 20) of the gearbox (10). The control device (24) and the actuator (28, 30) are arranged within the housing (22), with the pinion extending through an opening of the housing. A gearbox (10) with a housing (12) having an opening (44) receives the actuator unit (14), which closes and seals the opening (44).

Abstract: An actuating device (10) for an automated manual transmission (12) includes a pressure-medium-operated actuator (54) having a piston (58) and a piston rod (64) connectable to the selector element or shift element of the manual transmission. The piston is arranged in a cylindrical receiving chamber (50) of the housing (18) of the actuator and is coaxially movable therein. A sensor system (30)includes a magnet (38) arranged on a holding device (44) and a magnetic-field-sensitive sensor (32) is arranged on the housing radially with respect to the magnet (44).The holding device has a hollow cylindrical geometry, an anti-rotation element (80)is form-lockingly accommodated in an associated recess in the housing (18), and that the anti-rotation element extends across the holding device in the manner of a secant such that rotational movement of the holding device is blocked, although axial and rotational movement of the piston are possible.

Abstract: A valve device (2), of a pneumatically actuatable friction clutch engageable by spring force, includes at least one inlet valve (16, 18) connected on the input side to a pressurized supply line and on the output side to an actuating cylinder of the friction clutch. A pressure-sustaining valve (20, 28) is upstream or downstream of the inlet valve and is designed as a check valve closing in the backflow direction. The pressure-sustaining valve is a springless check valve and includes a housing ring (22, 30) having a retaining basket (36), a closing element (24, 32), and a valve seat (26, 34). The closing element, in the depressurized state and with a positive pressure gradient is held in the retaining basket (36) of the housing ring (22, 30) and, with a negative pressure gradient is pressed out of the retaining basket (36) and against the valve seat (26, 34).

Abstract: An apparatus determines a spatial position of an audio source in multi moving audio sources scenarios. The apparatus receives audio signal versions as local sound waves. The apparatus determines first and second probabilities for a direction of arrival of the audio signal version based on the audio signal versions received within a first time interval; determines third and fourth probabilities for the direction of arrival of the audio signal version based on the audio signal versions received within a second time interval; determines a first probability difference between the first and third probabilities; determines a second probability difference between the second and fourth probabilities; combines the third probability and the first probability difference to obtain an updated third probability; combines the fourth probability with the second probability difference to obtain an updated fourth probability; and determines the spatial position based on the updated third and fourth probabilities.

Abstract: A method and system provide for multi-surface patterning. An input target multi-surface consisting of multiple target surfaces is obtained. A first guide curve is obtained. A pattern is obtained. One or more section planes are created based on the pattern and the first guide curve. The one or more section planes are intersected with each of the multiple target surfaces resulting in an intersection curve for each of the multiple target surfaces. A single continuous curve is created from the intersecting curves. Points are generated based on the continuous curve, the first guide curve, and the pattern. An object is generated and placed based on the points.

Abstract: The disclosure relates to an audio processing apparatus for localizing an audio source. The audio processing apparatus comprises a plurality of audio sensors, including a primary audio sensor and at least two secondary audio sensors, configured to detect an audio signal from a target audio source, wherein the primary audio sensor defines at least two pairs of audio sensors with the at least two secondary audio sensors; and processing circuitry configured to: determine for each pair of audio sensors a first set of likelihoods of spatial directions of the target audio source using a first localization scheme; determine a second set of likelihoods of spatial directions of the target audio source using a second localization scheme; and determine a third set of likelihoods of spatial directions of the target audio source on the basis of the first sets of likelihoods and the second set of likelihoods.

Abstract: A method for controlling a charging apparatus of a vehicle, in particular an electric or hybrid vehicle, wherein the charging apparatus has a charging device including a protection and monitoring device. The vehicle includes a high-voltage on-board power system and an electrical energy storage apparatus connected to the high-voltage on-board power system. The method includes electrically connecting the high-voltage on-board power system to charging connections of an energy supply system by the charging apparatus. The charging connections include a neutral conductor, a protective conductor and at least one phase conductor. A protective conductor resistance is detected between the neutral conductor and the protective conductor by feeding in a test current by the protection and monitoring device. A frequency of the test current is filtered out of the compensation frequency range on a narrowband basis.

Abstract: A high-voltage system including a high-voltage battery and a DC/DC converter, the high-voltage system having two different galvanically connected voltage levels with enabled DC/DC converters. A first measuring device detects the voltage of the high-voltage battery and a second measuring device detects the voltage at the output of the DC/DC converter. An insulation resistance measuring device may be configured to carry out insulation resistance measurements only when the DC/DC converter is disabled. A third measuring device may detect a voltage between a positive high voltage line and the ground and a fourth measuring device and a voltage between a negative high-voltage line and the ground. An insulation monitoring device may monitor the insulation resistances from data of the first to fourth measuring device at least when the DC/DC converter is enabled.

Abstract: A high-voltage system comprising a high-voltage battery and a DC/DC converter, the high-voltage system having two different galvanically connected voltage levels with enabled DC/DC converters, the high-voltage system having a first measuring device for detecting the voltage of the high-voltage battery and a second measuring device for detecting the voltage at the output of the DC/DC converter, the high-voltage system having an insulation resistance measuring device which is designed in such a way as to carry out insulation resistance measurements only when the DC/DC converter is disabled, wherein the high-voltage system further comprises a third measuring device for detecting a voltage between a positive high-voltage line and the ground and a fourth measuring device for detecting a voltage between a negative high-voltage line and the ground, the high-voltage system having an insulation monitoring device which is designed such that the insulation resistances are monitored from the data of the first to fourth m

Abstract: A method for controlling a charging apparatus of a vehicle, in particular an electric or hybrid vehicle, wherein the charging apparatus has a charging device including a protection and monitoring device. The vehicle includes a high-voltage on-board power system and an electrical energy storage apparatus connected to the high-voltage on-board power system. The method includes electrically connecting the high-voltage on-board power system to charging connections of an energy supply system by the charging apparatus. The charging connections include a neutral conductor, a protective conductor and at least one phase conductor. A protective conductor resistance is detected between the neutral conductor and the protective conductor by feeding in a test current by the protection and monitoring device. A frequency of the test current is filtered out of the compensation frequency range on a narrowband basis.

Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.

Abstract: A method for producing a sinter layer connection between a substrate and a chip resulting in an electric and thermal connection therebetween and in reduced mechanical tensions within the chip. The method produces a sinter layer by applying a multitude of sinter elements of a base material forming the sinter layer in structured manner on a contact area of a main surface of a substrate; placing a chip to be joined to the substrate on the sinter elements; and heating and compressing the sinter elements to produce a structured sinter layer connecting the substrate and chip and extending within the contact area, the surface coverage density of the sinter elements on the substrate in a center region of the contact area being greater than the surface coverage density of the sinter elements in an edge region of the contact area, and at least one through channel, extending laterally as to the substrate's main surface being provided towards the contact area's edge.

Abstract: A commutation cell having at least one electrical capacitor, at least one controllable semiconductor switch and at least one semiconductor which is connected in series with the controllable semiconductor switch. The commutation cell has three circuit substrates situated in parallel with one another. The controllable semiconductor switch is connected in series with the semiconductor via a circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, and the two remaining circuit substrates being connected to one another in an electrically conductive manner via a subassembly made up of the controllable semiconductor switch, the semiconductor and the circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, the electrical capacitor being switched between the two remaining circuit substrates, separately from the subassembly.

Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.

Abstract: A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.

Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melti

Abstract: A commutation cell having at least one electrical capacitor, at least one controllable semiconductor switch and at least one semiconductor which is connected in series with the controllable semiconductor switch. The commutation cell has three circuit substrates situated in parallel with one another. The controllable semiconductor switch is connected in series with the semiconductor via a circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, and the two remaining circuit substrates being connected to one another in an electrically conductive manner via a subassembly made up of the controllable semiconductor switch, the semiconductor and the circuit substrate situated partially between the controllable semiconductor switch and the semiconductor, the electrical capacitor being switched between the two remaining circuit substrates, separately from the subassembly.

Abstract: An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.