Abstract: Arrangements for executing enterprise resource planning software in a plurality of modes are presented. A graphical user interface may allow an administrator to select from the plurality of modes for executing the enterprise resource planning software, such as a test mode and a production mode. A selection of one of the modes may be received. The selected mode may be linked with a particular initialization file that is used to initialize the enterprise resource software. The enterprise resource planning software may be initialized and run using the selected initialization file.

Abstract: Arrangements for executing enterprise resource planning software in a plurality of modes are presented. A graphical user interface may allow an administrator to select from the plurality of modes for executing the enterprise resource planning software, such as a test mode and a production mode. A selection of one of the modes may be received. The selected mode may be linked with a particular initialization file that is used to initialize the enterprise resource software. The enterprise resource planning software may be initialized and run using the selected initialization file.

Abstract: Arrangements for executing enterprise resource planning software in a plurality of modes are presented. A graphical user interface may allow an administrator to select from the plurality of modes for executing the enterprise resource planning software, such as a test mode and a production mode. A selection of one of the modes may be received. The selected mode may be linked with a particular initialization file that is used to initialize the enterprise resource software. The enterprise resource planning software may be initialized and run using the selected initialization file.

Abstract: A process for computer-controlled cleaning of particulates from surfaces, in particular those of semiconductor wafers, which are in the volume of an ion-implantation chamber prior to the implantation of electrically active ions into the wafers. The process utilizes the wafer-holding disk, which carries the semiconductor wafers during implantation, to create a strong turbulence of gas within the end station volume of the ion implanter. This loosens particulates from interior surfaces of the end chamber. The airborne particulates are then evacuated from the chamber volume by a vacuum pump. A single sequence, consisting of air agitation followed by flushing and then filling, reduces the particulate count by an incremental amount; a series of such sequences results in the desired asymptotic reduction in particulate contamination.