Abstract: A bracket assembly for an exercise apparatus is disclosed. The bracket assembly includes a plate member having a U-shaped chamber. The plate member includes a gusset extending from an outer side of the plate member. The plate member further includes a pin extending from the outer side of the plate member. The gusset receives a rack of an exercise apparatus. The pin inserts in one of a plurality of rack openings and connects the bracket assembly to the rack. A user places a barbell in the plate member through the U-shaped chamber. The U-shaped chamber allows the user to have a safe and controlled upward and downward motion for performing exercises with the barbell while in a seated or standing position. The U-shaped chamber acts as a holder for the barbell and prevents the user from tipping over or losing balance holding the barbell in the chamber.

Abstract: A bracket assembly for an exercise apparatus and the like is disclosed. The bracket assembly includes a plate member having a U-shaped chamber. The plate member includes a gusset extending from an outer side of the plate member. The plate member further includes a pin extending from the outer side of the plate member. The gusset receives a rack of an exercise apparatus. The pin inserts in one of a plurality of rack openings and connects the bracket assembly to the rack. A user places a barbell in the plate member through the U-shaped chamber. The U-shaped chamber allows the user to have a safe and controlled upward and downward motion for performing exercises with the barbell while in a seated or standing position. The U-shaped chamber acts as a holder for the barbell and prevents the user from tipping over or losing balance holding the barbell in the chamber.

Abstract: The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.

Abstract: This invention is for a rapid penetrating skin treatment emulsion characterized by an ability to very rapidly penetrate into the epidermis and dermis carrying efficacious additives with it as it penetrates into the skin. The ability to penetrate into the skin is due to the physical structure of the emulsion, which in turn is as a consequence of its ingredients, and the concentration of each ingredient.

Abstract: An apparatus and method for treating the walls of apertures passing through a planar substrate with a fluid treatment solution. The method comprises placement of a pressurized fluid wedge beneath, above, or both beneath and above a planar substrate as it passes through a treatment chamber. The apparatus that forms the fluid wedge is a roller assembly comprising a roller within a shroud which carries fluid as it rotates through a gap between the roller and the shroud. The roller provides the dual function of forming the fluid wedge and conveying the planar substrate through the treatment chamber.

Abstract: An apparatus and method for treating the walls of apertures passing through a planar substrate with a fluid treatment solution. The method comprises placement of a pressurized fluid wedge beneath, above, or both beneath and above a planar substrate as it passes through a treatment chamber. The apparatus that forms the fluid wedge is a roller assembly comprising a roller within a shroud which carries fluid as it rotates through a gap between the roller and the shroud. The roller provides the dual function of forming the fluid wedge and conveying the planar substrate through the treatment chamber.

Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.

Abstract: A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.

Abstract: A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

Abstract: This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.

Abstract: A process for metal plating characterized by use of an accelerator solution of a metal reducible by stannous tin between a step of catalysis and metal deposition.

Abstract: A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.

Abstract: A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.

Abstract: This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaining photoresist coating unprotected by the metal mask.

Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Abstract: A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

Abstract: An apparatus for maintaining the consumable components of an electroless plating solution at predetermined concentration in a plating tank containing the plating solution while workpieces are being processed in the tank. The apparatus measures the concentrations of the consumable components in a sample stream of the electroless plating solution and based on these measurements, meters the required amounts of the components into the plating solution. A portion of the apparatus provides for the introduction of plating solution poison into the sample stream to prevent autocatalytic decomposition and deposition of the plating metal, e.g., copper, onto to the walls and sensors of the apparatus.