Abstract: A method for producing a sinter layer connection between a substrate and a chip resulting in an electric and thermal connection therebetween and in reduced mechanical tensions within the chip. The method produces a sinter layer by applying a multitude of sinter elements of a base material forming the sinter layer in structured manner on a contact area of a main surface of a substrate; placing a chip to be joined to the substrate on the sinter elements; and heating and compressing the sinter elements to produce a structured sinter layer connecting the substrate and chip and extending within the contact area, the surface coverage density of the sinter elements on the substrate in a center region of the contact area being greater than the surface coverage density of the sinter elements in an edge region of the contact area, and at least one through channel, extending laterally as to the substrate's main surface being provided towards the contact area's edge.

Abstract: In a method for manufacturing a connecting contact for an electrode of an electrochemical store, the electrode having a first material, a contact element made of a second material is provided, the contact element having a section coated using the first material, and the coated section is electrically and mechanically connected to the electrode to manufacture the connecting contact.

Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melti

Abstract: The invention relates to an electrical contact, particularly designed as a press-in pin (16) for a circuit carrier (10). The press-in pin comprises at least one press-in zone (14) at which conductor traces (30) can be contacted. The press-in pin (16) is either made of solid aluminum material (36) or contains at least one aluminum material section (40) or is made of solid aluminum material (36, 46) with a copper jacket coating (48).

Abstract: The invention relates to an electrical contact, particularly designed as a press-in pin (16) for a circuit carrier (10). The press-in pin comprises at least one press-in zone (14) at which conductor traces (30) can be contacted. The press-in pin (16) is either made of solid aluminium material (36) or contains at least one aluminium material section (40) or is made of solid aluminium material (36, 46) with a copper jacket coating (48).

Abstract: The invention relates to a contact element (10) with a plug side (14) and a solder side (16) to be contacted with a circuit board or a carrier substrate. The contact element (10) is produced from an Al/Cu material composite (36), the Cu portion (42) of which forms the plug side (14) and the Al portion (44) of which forms the solder side (16) of the contact element (10).

Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melti

Abstract: The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.

Abstract: A method for producing a sinter layer connection between a substrate and a chip resulting in an electric and thermal connection therebetween and in reduced mechanical tensions within the chip. The method produces a sinter layer by applying a multitude of sinter elements of a base material forming the sinter layer in structured manner on a contact area of a main surface of a substrate; placing a chip to be joined to the substrate on the sinter elements; and heating and compressing the sinter elements to produce a structured sinter layer connecting the substrate and chip and extending within the contact area, the surface coverage density of the sinter elements on the substrate in a center region of the contact area being greater than the surface coverage density of the sinter elements in an edge region of the contact area, and at least one through channel, extending laterally as to the substrate's main surface being provided towards the contact area's edge.

Abstract: In a method for manufacturing a connecting contact for an electrode of an electrochemical store, the electrode having a first material, a contact element made of a second material is provided, the contact element having a section coated using the first material, and the coated section is electrically and mechanically connected to the electrode to manufacture the connecting contact.

Abstract: In a method for fastening a planar substrate having an electric circuit at a mounting position on a mounting element, a holding arrangement acts upon the planar substrate to fasten it, an activatable expansion arrangement being used as the holding arrangement.

Abstract: In a method for fastening a planar substrate having an electric circuit at a mounting position on a mounting element, a holding arrangement acts upon the planar substrate to fasten it, an activatable expansion arrangement being used as the holding arrangement.