Abstract: A line circuit module is disclosed which comprises effectively all of the required circuitry for a line card apart from mechanical components such as relays and edge card connectors. The module includes a small ceramic substrate 2.0 inches by 0.825 inches on to which surface mount components which include a heat sensitive integrated circuit and a field effect transistor are mounted to one side and thick film components which include two battery feed resistors are printed on an opposite side. Various innovative techniques are disclosed which significantly reduce compromising component thermal interactions. Heat concerns from using a small thermally conductive substrate have been managed through advantageous use of printed battery feed resistor layouts which provide for larger portions of heat to be dissipated in resistor portions removed from a heat sensitive integrated circuit than resistor portions adjacent to the heat sensitive integrated circuit.

Abstract: Circuit pack wherein the electronic components are arranged with high temperature operating components on one side of a PCB and low temperature components on the other side. The PCB acts as a thermal insulator to restrict heat flow from the hot to cooler components. The components on each side of the board are disposed in a vertical connection chimney for heat removal.

Abstract: A three dimensionally adjustable frame designed to surround an easy chair having abbreviated armrests and providing a fulcrum support against which a user of the chair may bear and pivot about to aid in arising therefrom. The adjustable frame includes inter-engaging slidebar members which provide slideable adjustment thereof. The top portion of the adjustable frame carries a pair of fulcrum support members which extend outwardly from and in front of the front end of each armrest of the easy chair, thereby providing a bearing surface and fulcrum grip which the user of the chair can grasp to aid oneself when arising therefrom.