Abstract: Maintaining proper planarity of elements of a microelectronic component test system helps ensure reliable operation of the test system. Aspects of the invention provide test systems and methods for verifying planarity of, for example, a head and a support surface of a microelectronic component test system. In one exemplary method, a probe card is mounted to and electrically coupled to a head of a microelectronic component test system. The probe card has an array of probes. A contact surface of the support is moved with respect to the head and a change in contact condition of each of the probes is recorded in a first data set. The orientation of the probe card with respect to the contact surface is changed, the contact surface is moved with respect to the head again and a change in contact condition of each of the probes is recorded in a second data set.

Abstract: Methods of verifying planarity of a microelectronic component support of a microelectronic component test system with respect to a head of the test system are disclosed herein. In one embodiment, a method includes juxtaposing a probe card with a contact surface that is carried by the microelectronic, component support. The probe card has probes extending toward the contact surface. The method further includes changing a distance along a Z axis between the probe card and the contact surface and recording in a first data set a Z coordinate of the contact surface at which each probe changes a contact condition with respect to a first location on the contact surface. The method also includes spacing the probes from the contact surface, and translating at least one of the probe card and the contact surface with respect to an X-Y plane.

Abstract: Maintaining proper planarity of elements of a microelectronic component test system helps ensure reliable operation of the test system. Aspects of the invention provide test systems and methods for verifying planarity of, for example, a head and a support surface of a microelectronic component test system. In one exemplary method, a probe card is mounted to and electrically coupled to a head of a microelectronic component test system. The probe card has an array of probes. A contact surface of the support is moved with respect to the head and a change in contact condition of each of the probes is recorded in a first data set. The orientation of the probe card with respect to the contact surface is changed, the contact surface is moved with respect to the head again and a change in contact condition of each of the probes is recorded in a second data set.

Abstract: Maintaining proper planarity of elements of a microelectronic component test system helps ensure reliable operation of the test system. This disclosure suggests test systems and methods for verifying planarity of, for example, a head and a support surface of a microelectronic component test system. In one exemplary method, a probe card is mounted to and electrically coupled to a head of a microelectronic component test system. The probe card has an array of probes. A contact surface of the support is moved with respect to the head and a change in contact condition of each of the probes is recorded in a first data set. The orientation of the probe card with respect to the contact surface is changed, the contact surface is moved with respect to the head again, and a change in contact condition of each of the probes is recorded in a second data set.

Abstract: Maintaining proper planarity of elements of a microelectronic component test system helps ensure reliable operation of the test system. Aspects of the invention provide test systems and methods for verifying planarity of, for example, a head and a support surface of a microelectronic component test system. In one exemplary method, a probe card is mounted to and electrically coupled to a head of a microelectronic component test system. The probe card has an array of probes. A contact surface of the support is moved with respect to the head and a change in contact condition of each of the probes is recorded in a first data set. The orientation of the probe card with respect to the contact surface is changed, the contact surface is moved with respect to the head again and a change in contact condition of each of the probes is recorded in a second data set.

Abstract: A PC adapter card system is disclosed. The system includes a connector set and a base unit. The connector set has a plurality of connection ports. The connector set sends/receives data to/from network resources through a communication device. The connector set is adapted to convert the data into a compatible format, such that the connection ports are compatible for connection with the communication device of a particular locality. The base unit interfaces data between the connector set and a computer. The base unit sends/receives data from said connector set in a standard format by selecting a compatible connector set for the particular locality.

Abstract: A PC adapter card system is disclosed. The system includes a connector set and a base unit. The connector set has a plurality of connection ports. The connector set sends/receives data to/from network resources through a communication device. The connector set is adapted to convert the data into a compatible format, such that the connection ports are compatible for connection with the communication device of a particular locality. The base unit interfaces data between the connector set and a computer. The base unit sends/receives data from said connector set in a standard format by selecting a compatible connector set for the particular locality.