Patents by Inventor Michael H. Mikasa

Michael H. Mikasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9380703
    Abstract: An electronics system includes a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (IC) located on the carrier board, wherein the IC is electrically connected to the main circuitry on the main circuit board; and a layer of adhesive located between the carrier board and the main circuit board.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: June 28, 2016
    Assignee: RAYTHEON COMPANY
    Inventors: Robert M. Glidden, IV, Clay Johnson, Michael H. Mikasa
  • Publication number: 20140233201
    Abstract: An electronics system includes a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (IC) located on the carrier board, wherein the IC is electrically connected to the main circuitry on the main circuit board; and a layer of adhesive located between the carrier board and the main circuit board.
    Type: Application
    Filed: February 20, 2013
    Publication date: August 21, 2014
    Applicant: RAYTHEON COMPANY
    Inventors: Robert M. Glidden, IV, Clay Johnson, Michael H. Mikasa