Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment a semiconductor device comprises a first interlayer dielectric (ILD), a plurality of source/drain (S/D) contacts in the first ILD, a plurality of gate contacts in the first ILD, wherein the gate contacts and the S/D contacts are arranged in an alternating pattern, and wherein top surfaces of the gate contacts are below top surfaces of the S/D contacts so that a channel defined by sidewall surfaces of the first ILD is positioned over each of the gate contacts, mask layer partially filling a first channel over a first gate contact, and a fill metal filling a second channel over a second gate contact that is adjacent to the first gate contact.

Abstract: This invention relates to a quickly assembled prefabricated metal concrete pouring form for slabs and the like that remains in place as an integral part of the finished structure. The basic elements of the structure are exterior wall sections with each containing a series of vertically-aligned pairs of slots arranged in parallel horizontal rows throughout the length thereof and which can be telescoped into overlapping relation to place selected pairs of these slots in registry with one another to receive the hook-forming elements of one or more types of connectors that lock the sections together in freestanding assembled condition. Two of these connectors, namely, a ground stake and a detachable endpiece of a spreader subassembly both include a vertically-spaced pair of downturned hook-forming elements to effect the locking action while the corner sections employ horizontally-spaced pairs of horizontally-disposed tongues for this same purpose.