Patents by Inventor Michael H. Williams

Michael H. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250067404
    Abstract: A natural gas system includes a process suction conduit, a compressor package to receive natural gas from the process suction conduit and to increase a pressure of the flow of natural gas whereby it is discharged from the compressor package as a pressurized flow of natural gas, a process discharge conduit connected downstream of the compressor package, and an emissions management module coupled to the compressor package and configured to capture emissions from the compressor package, wherein the emissions management module includes a vapor recovery unit configured to circulate the captured emissions from the VRU along an emissions discharge conduit coupled to the VRU such that the captured emissions are discharged directly to at least one of the process suction conduit, a fuel gas system of the natural gas system, and a hydrocarbon processing component of the natural gas system that is separate from the compressor package.
    Type: Application
    Filed: November 13, 2024
    Publication date: February 27, 2025
    Applicant: Archrock Services, L.P.
    Inventors: Benjamin Castagnos, Tyler Davis, Benjamin Galassini, John H. Johnson, Evan Elie Judice, Michael Wasson, Walter E. Williams
  • Patent number: 8677708
    Abstract: A wall structure includes first and second panels joined to form a stud and a first wall layer. A fastener extends through the first wall layer and into the stud. Each panel includes first and a second ends. The first end of one panel and the second end of the other panel form a portion of the stud. The ends of the panels can nest. The wall structure can include multiple wall layers arranged such that the seams formed by components of each wall layer are staggered with respect to the seams in adjacent wall layers. Reinforcing members and fasteners can secure the wall layers to the remainder of the structure. A similarly constructed roof structure can be joined with multiple wall structures to form a building.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: March 25, 2014
    Assignee: A&A Sheet Metal Products, Inc.
    Inventor: Michael H. Williams
  • Publication number: 20120000139
    Abstract: A wall structure includes a first panel, a second panel joined to the first panel to form a stud and a first wall layer. A fastener extends through the first wall layer and into the stud. Each panel includes a first end and a second end. The first end of one panel and the second end of the other panel can form at least a portion of the stud. The ends of the panels can nest to form a portion of the stud. The wall structure can include multiple wall layers arranged such that the seams formed by individual members of each wall layer are staggered with respect to the seams formed by individual members of the adjacent wall layers. Reinforcing members and fasteners can be used to secure the wall layers to the remainder of the wall structure. A roof structure includes a first panel, a second panel joined to the first panel to form a stud and a first roof layer. A fastener extends through the first roof layer and into the stud. Each panel includes a first end and a second end.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 5, 2012
    Applicant: A & A Sheet Metal Products, Inc.
    Inventor: Michael H. Williams
  • Patent number: 4734641
    Abstract: A method for determining the thermal characteristics of a semiconductor packaging system is provided which uses a platinum resistor test unit. The platinum resistor is preferably sized to approximate the dimensions of the semiconductor device for which the package was designed, and is installed within the package. The packaged resistor is then thermally calibrated at a plurality of temperature levels to generate a linear temperature versus resistance graph or equation corresponding thereto. Next, voltage is applied to the packaged resistor causing such resistor to "self heat." Its resistance is calculated, and the temperature corresponding thereto is obtained from the graph or equation. Such temperature is the surface temperature of the resistor. This temperature may then be used to calculate the temperature gradient from the inside of the package to any reference point on or near the outside of the package, the temperature of which has been previously determined.
    Type: Grant
    Filed: March 9, 1987
    Date of Patent: March 29, 1988
    Assignee: Tektronix, Inc.
    Inventors: Dee H. Byrd, Jr., Michael H. Williams