Abstract: The invention relates to a safety valve comprising a pilot valve element, a pilot valve actuator, a main valve element cooperating with a main valve seat, a permanent magnet being provided which is associated with the main valve element and which is adapted to hold the latter in an open position, and a main valve actuator being provided which cooperates with the main valve element.

Abstract: The invention relates to a safety valve comprising a pilot valve element, a pilot valve actuator, a main valve element cooperating with a main valve seat, a permanent magnet being provided which is associated with the main valve element and which is adapted to hold the latter in an open position, and a main valve actuator being provided which cooperates with the main valve element.

Abstract: A frame for dampening vibrations in a printed circuit board (PCB) assembly is provided. The frame includes a substrate having a first surface and a second surface and multiple ridges extending from at least one of the first and second surfaces. The ridges define recesses, and at least one of the recesses is configured to accommodate an electronic component of a PCB in the PCB assembly. Also provided is a PCB assembly including a PCB and the frame.

Abstract: A frame for dampening vibrations in a printed circuit board (PCB) assembly is provided. The frame includes a substrate having a first surface and a second surface and multiple ridges extending from at least one of the first and second surfaces. The ridges define recesses, and at least one of the recesses is configured to accommodate an electronic component of a PCB in the PCB assembly. Also provided is a PCB assembly including a PCB and the frame.

Abstract: A three phase invertor has five coplanar leadframes for 2d-c terminals and 3a-c terminals. Power MOSFETs soldered around the periphery of one of the d-c leadframes are wire bonded to adjacent ones of the 3a-c leadframes which are mounted alongside the two edges and an end of one of the d-c leadframes. Further switching die are soldered to the 3a-c leadframes and wire bonded to the other d-c leadframe. The die are spaced along and follow a general U-shaped path. The leadframes are mounted on a heat sink which receives an insulation spacer and cap to form a hermetically sealed volume around the leadframes and die. The heat sink has cavities to mount bus capacitors and has a water cooling channel which follows and is below the U-shaped path of the die.