Patents by Inventor Michael Harmes

Michael Harmes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070015340
    Abstract: Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts, decrease planarization uniformity requirements, and facilitate contact bonding at lower temperatures and pressures by employing shapes and materials that respond predictably to compressive interfacing loads.
    Type: Application
    Filed: September 18, 2006
    Publication date: January 18, 2007
    Inventors: Mauro Kobrinsky, R. List, Sarah Kim, Michael Harmes
  • Publication number: 20050184400
    Abstract: Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts, decrease planarization uniformity requirements, and facilitate contact bonding at lower temperatures and pressures by employing shapes and materials that respond predictably to compressive interfacing loads.
    Type: Application
    Filed: February 7, 2005
    Publication date: August 25, 2005
    Inventors: Mauro Kobrinsky, R. List, Sarah Kim, Michael Harmes
  • Publication number: 20050003650
    Abstract: Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection.
    Type: Application
    Filed: July 2, 2003
    Publication date: January 6, 2005
    Inventors: Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro Kobrinsky, Sarah Kim, Kevin O'Brien, Michael Harmes, Thomas Marieb