Abstract: The invention relates to a method for determining the temperature of a power electronics unit (1) which has at least one commutator circuit (2) and a load (3) which is powered/can be powered by the commutator circuit (2). The commutator circuit (2) comprises a first semiconductor switch device (4), which has a first semiconductor switch (5) and optionally a first diode (6), and a second diode (9), wherein the second diode (9) and the load (3) are connected in parallel to the first semiconductor switch (5). The curve of an electric current flowing through the second diode (9) is monitored at least when a reverse current is produced in the second diode (9) after the semiconductor switch (5) has been switched so as to become conductive. On the basis of the current curve, the temperature of a barrier layer of the second diode (9) is determined.

Abstract: The invention relates to a method for determining the temperature of a power electronics unit (1) which has at least one commutator circuit (2) and a load (3) which is powered/can be powered by the commutator circuit (2). The commutator circuit (2) comprises a first semiconductor switch device (4), which has a first semiconductor switch (5) and optionally a first diode (6), and a second diode (9), wherein the second diode (9) and the load (3) are connected in parallel to the first semiconductor switch (5). The curve of an electric current flowing through the second diode (9) is monitored at least when a reverse current is produced in the second diode (9) after the semiconductor switch (5) has been switched so as to become conductive. On the basis of the current curve, the temperature of a barrier layer of the second diode (9) is determined.

Abstract: The disclosure herein provides methods, systems, and devices for hands-free binding that offer enhanced convenience, style, and performance. In an embodiment, the systems and devices disclosed herein comprise a binding system having an opening. In an embodiment, the binding system can be configured to change the size of the opening to allow for an item to be inserted, secured, released, and/or removed. In an embodiment, the binding system can be configured to be able to change its profile.

Abstract: The disclosure herein provides methods, systems, and devices for hands-free binding that offer enhanced convenience, style, and performance. In an embodiment, the systems and devices disclosed herein comprise a binding system having an opening. In an embodiment, the binding system can be configured to change the size of the opening to allow for an item to be inserted, secured, released, and/or removed. In an embodiment, the binding system can be configured to be able to change its profile.

Abstract: The disclosure herein provides methods, systems, and devices for hands-free binding that offer enhanced convenience, style, and performance. In an embodiment, the systems and devices disclosed herein comprise a binding system having an opening. In an embodiment, the binding system can be configured to change the size of the opening to allow for an item to be inserted, secured, released, and/or removed. In an embodiment, the binding system can be configured to be able to change its profile.

Abstract: The invention relates to a method for operating an electrical machine (1) controlled by an inverter (2), wherein the inverter (2) comprises half-bridge branches (10-U, 10-V, 10-W) having power components in the form of controllable power switching elements (3) and power diodes (4) respectively connected in parallel therewith, wherein each of the half-bridge branches (10-U; 10-V; 10-W) is arranged on a separate semiconductor module (11-U; 11-V; 11-W), which are arranged jointly on a baseplate (12), wherein the phase currents (1_U, 1_V, 1_W) flowing through the half-bridge branches (10-U, 10-V, 10-W), the voltages present at the power components and temperatures (t_Sens_U, t_Sens_V, t_Sens_W) on the semiconductor modules (11-U, 11-V, 11-W) are determined, from the current (1_U; 1_V; 1_W) respectively flowing at a power component and from the voltage respectively present a power loss (P) is calculated for each of the power components, from the power losses (P) a relevant temperature swing (?t; ?t_Sens) is determ

Abstract: The invention relates to a method for operating an electrical machine (1) controlled by an inverter (2), wherein the inverter (2) comprises half-bridge branches (10-U, 10-V, 10-W) having power components in the form of controllable power switching elements (3) and power diodes (4) respectively connected in parallel therewith, wherein each of the half-bridge branches (10-U; 10-V; 10-W) is arranged on a separate semiconductor module (11-U; 11-V; 11-W), which are arranged jointly on a baseplate (12), wherein the phase currents (1_U, 1_V, 1_W) flowing through the half-bridge branches (10-U, 10-V, 10-W), the voltages present at the power components and temperatures (t_Sens_U, t Sens_V, t_Sens_W) on the semiconductor modules (11-U, 11-V, 11-W) are determined, from the current (1_U; 1_V; 1_W) respectively flowing at a power component and from the voltage respectively present a power loss (P) is calculated for each of the power components, from the power losses (P) a relevant temperature swing (?t; ?t_Sens) is determ