Abstract: A light emitting device includes a silicon substrate having a (100) upper surface. The (100) upper surface has a recess, the recess being defined in part by (111) surfaces of the silicon substrate. The light emitting device includes a GaN crystal structure over one of the (111) surfaces which has a non-polar plane and a first surface along the non-polar plane. Light emission layers over the first surface have at least one quantum well comprising GaN.

Abstract: A light emitting device includes a silicon substrate having a (100) upper surface. The (100) upper surface has a recess, the recess being defined in part by (111) surfaces of the silicon substrate. The light emitting device includes a GaN crystal structure over one of the (111) surfaces which has a non-polar plane and a first surface along the non-polar plane. Light emission layers over the first surface have at least one quantum well comprising GaN.

Abstract: A light emitting device includes a silicon substrate comprising a (111) surface and a GaN crystal structure over the (111) surface of the silicon substrate. The GaN crystal structure includes a first surface along a semi-polar plane of the GaN crystal structure and a second surface along a polar plane of the GaN crystal structure. The light emitting device also includes light emission layers over the first surface of the GaN crystal structure. The light emission layers include at least one quantum well comprising GaN.

Abstract: What is described here is a process for the initial growth of nitrogenous semiconductor crystal materials in the form AXBYCZNVMW wherein A, B, C is an element of group II or III, N is nitrogen, M represents an element of group V or VI, and X, Y, Z, W denote the molar fraction of each element of this compound, using a, which are deposited on sapphire, SiC or Si, using various ramp functions permitting a continuous variation of the growth parameters during the initial growth.

Abstract: What is described here is a method and a temperature management and reaction chamber system for the production of nitrogenous semiconductor crystal materials of the form AXBYCZNVMW, wherein A, B, C represent elements of group II or III, N represents nitrogen, M represents an element of group V or VI, and X, Y, Z, V, W represent the mol fraction of each element in this compound, operating on the basis of gas phase compositions and gas phase successions. The invention excels itself by the provisions that for the production of the semiconductor crystal materials the production process is controlled by the precise temperature control of defined positions in the reaction chamber system under predetermined conditions.

Abstract: The invention relates to a device and to a method for depositing especially crystalline layers from the gas phase onto especially crystalline substrates. The device comprises a heated reaction chamber with a substrate support that receives at least one substrate; one or more heated sources where a gaseous halide is formed by chemical reaction of a halogen, especially HCl, fed to the source together with a substrate gas, and a metal, for example GA, In, Al associated with the source, which is transported through a gas inlet section to a substrate supported by the substrate support; and a hydride supply for supplying a hydride, especially NH3, AsH3 or PH3 into the reaction chamber. A plurality of rotationally driven substrate supports is disposed in an annular arrangement on a substrate support carrier, the sources being disposed in the center of said substrate carrier.

Abstract: The invention relates to a device comprising a process chamber which is arranged in a reaction housing and which can be heated especially by supplying heat to a substrate holder, comprising a gas inlet for the admission of gaseous starting material, whereby the decomposition products thereof are deposited on a substrate maintained by a substrate holder to form a layer, also comprising at least one sensor acting upon the inside of the process chamber for determining layer properties further comprising an electronic control unit for controlling the heating of the process chamber, mass controllers for controlling the flow of the starting materials and a pump for controlling the pressure of the process chamber, characterized in that the electronic control unit forms modified process parameters from deviation values obtained upon growth of the calibrating layer with the aid of stored calibrating parameters, thereby controlling the heating of the process chamber, the flow controllers and the pump upon growth of the

Abstract: The invention relates to a method and a device for coating at least one substrate with a thin layer in a processing chamber of a reactor. A solid or liquid starting material stored at least in a reservoir is guided into the processing chamber as a gas or an aerosol by means of a carrier gas, where it is condensed on the substrate. The solid or liquid starting material is maintained at a source temperature which is higher than the substrate temperature. In order to enable a targeted adjustment of the composition, sequence of layers and properties of the contact surface which determine the properties of the components, the carrier gas flows through the starting material and the supply of the gaseous starting material to the processing chamber is controlled by means of at least one valve and one mass flow regulator.

Abstract: This invention relates to a method for coating at least one substrate with one or more layers in a process chamber, in particular of a CVD installation. According to said method, starting materials, in particular in the form of organometallic reaction gases are introduced into the process chamber and their mass flow is controlled. In said chamber, the starting materials or reaction products thereof are deposited on layers on the substrate that is held by a temperature controlled substrate holder. During a coating cycle, which begins with the charging of the process chamber with the substrate or substrates and ends with the removal of the same according to a predetermined formula, the desired values of the process parameters, such as mass flows of the starting materials and temperature of the substrate holder, are set and the actual values for each substrate that correspond with the desired values of the process parameters are individually determined at intervals and are stored in a memory.

Abstract: The invention relates to a device comprising a process chamber which is arranged in a reaction housing and which can be heated especially by supplying heat to a substrate holder, comprising a gas inlet for the admission of gaseous starting material, whereby the decomposition products thereof are deposited on a substrate maintained by a substrate holder to form a layer, also comprising at least one sensor acting upon the inside of the process chamber for determining layer properties further comprising an electronic control unit for controlling the heating of the process chamber, mass controllers for controlling the flow of the starting materials and a pump for controlling the pressure of the process chamber, characterized in that the electronic control unit forms modified process parameters from deviation values obtained upon growth of the calibrating layer with the aid of stored calibrating parameters, thereby controlling the heating of the process chamber, the flow controllers and the pump upon growth of the

Abstract: The invention relates to a device and to a method for depositing especially crystalline layers from the gas phase onto especially crystalline substrates. The device comprises a heated reaction chamber with a substrate support that receives at least one substrate; one or more heated sources where a gaseous halide is formed by chemical reaction of a halogen, especially HCl, fed to the source together with a substrate gas, and a metal, for example GA, In, Al associated with the source, which is transported through a gas inlet section to a substrate supported by the substrate support; and a hydride supply for supplying a hydride, especially NH3, AsH3 or PH3 into the reaction chamber. A plurality of rotationally driven substrate supports is disposed in an annular arrangement on a substrate support carrier, the sources being disposed in the center of said substrate carrier.

Abstract: The invention relates to a method and a device for producing Group-III-N, Group-III-V-N and metal-nitrogen component structures on Si substrates by means of organometallic gas phase epitaxy.

Abstract: What is described here is a method and a temperature management and reaction chamber system for the production of nitrogenous semiconductor crystal materials of the form AXBYCZNVMW, wherein A, B, C represent elements of group II or III, N represents nitrogen, M represents an element of group V or VI, and X, Y, Z, V, W represent the mol fraction of each element in this compound, operating on the basis of gas phase compositions and gas phase successions. The invention excels itself by the provisions that for the production of the semiconductor crystal materials the production process is controlled by the precise temperature control of defined positions in the reaction chamber system under predetermined conditions.

Abstract: What is described here is a method of producing a wafer support having a protective layer, which, after the specifically mechanically prefabricated wafer support has been cleaned, is characterized by heating the cleaned wafer support to temperatures, by introducing coating components for conversion of the wafer support surface into the protective layer or for deposition of components supplied to a protective layer.

Abstract: Disclosed is a process for producing p-type doped layers, in particular, in II-VI semiconductors, in which the p-type doped layer is produced in a CVD-step by means of plasma activation of nitrogenated gases.