Patents by Inventor Michael Hirscher

Michael Hirscher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing a Fresnel Zone Plate for applications in high energy radiation
    Patent number: 9859028
    Abstract: The invention concerns to a method of producing a Fresnel Zone Plate (1) for applications in high energy radiation including the following steps: supply of a substrate (2) transparent for high energy radiation, deposition of a layer (3) of a metal, a metal alloy or a metal compound on a planar surface (4) of the substrate (2), calculating a three dimensional geometrical profile (5) with a mathematical model, setting up a dosage profile (6) for an ion beam of the ion beam lithography inverse to the calculated three dimensional geometrical profile (5) and milling a three dimensional geometrical profile (5) with concentric zones into the layer (3) with ion beam lithography by means of focused ion beam.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: January 2, 2018
    Assignee: Max-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.
    Inventors: Gisela Schuetz, Corinne Grevent, Kahraman Keskinbora, Michael Hirscher
  • Method of Producing a Fresnel Zone Plate for Applications in High Energy Radiation
    Publication number: 20150022892
    Abstract: The invention concerns to a method of producing a Fresnel Zone Plate (1) for applications in high energy radiation including the following steps: supply of a substrate (2) transparent for high energy radiation, deposition of a layer (3) of a metal, a metal alloy or a metal compound on a planar surface (4) of the substrate (2), calculating a three dimensional geometrical profile (5) with a mathematical model, setting up a dosage profile (6) for an ion beam of the ion beam lithography inverse to the calculated three dimensional geometrical profile (5) and milling a three dimensional geometrical profile (5) with concentric zones into the layer (3) with ion beam lithography by means of focused ion beam.
    Type: Application
    Filed: March 7, 2013
    Publication date: January 22, 2015
    Applicant: Max-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.
    Inventors: Gisela Schuetz, Corinne Grevent, Kahraman Keskinbora, Michael Hirscher