Patents by Inventor Michael Hochman

Michael Hochman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMUT devices and fabrication methods
    Patent number: 8766459
    Abstract: Capacitive micromachined ultrasonic transducer (“CMUT”) devices and fabrication methods are provided. The CMUT devices can include integrated circuit devices utilizing direct connections to various CMOS electronic components. The use of integrated connections can reduce overall package size and improve functionality for use in ultrasonic imaging applications. CMUT devices can also be manufactured on multiple silicon chip layers with each layer connected utilizing through silicon vias (TSVs). External power connections can be provided if high biasing voltages are required. Forward and side looking CMUT arrays can be manufactured for use in a variety of ultrasound technologies.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: July 1, 2014
    Assignee: Georgia Tech Research Corporation
    Inventors: F. Levent Degertekin, Gokce Gurun, Jaime Zahorian, Michael Hochman
  • CMUT DEVICES AND FABRICATION METHODS
    Publication number: 20130127065
    Abstract: Capacitive micromachined ultrasonic transducer (“CMUT”) devices and fabrication methods are provided. The CMUT devices can include integrated circuit devices utilizing direct connections to various CMOS electronic components. The use of integrated connections can reduce overall package size and improve functionality for use in ultrasonic imaging applications. CMUT devices can also be manufactured on multiple silicon chip layers with each layer connected utilizing through silicon vias (TSVs). External power connections can be provided if high biasing voltages are required. Forward and side looking CMUT arrays can be manufactured for use in a variety of ultrasound technologies.
    Type: Application
    Filed: May 3, 2011
    Publication date: May 23, 2013
    Inventors: Levent F. Degertekin, Gokce Gurun, Jaime Zahorian, Michael Hochman