Abstract: A device is proposed for the contactless grasping and holding of an object from a direction directed at least partially in the direction of the force of gravity, using a holding element situated counter to the direction of the force of gravity, at least partially above the object and at a distance from the latter, which to the greatest extent possible avoids the carrying off or migrating of particles that are possibly present. According to the present invention this is achieved in that the holding element is designed as a vibrating holding element for generating levitation waves.

Abstract: A device is proposed for the contactless grasping and holding of an object (1) from a direction (z) directed at least partially in the direction (z) of the force of gravity (F), using a holding element (3) situated counter to the direction (z) of the force of gravity (F), at least partially above the object (1) and at a distance from the latter, which to the greatest extent possible avoids the carrying off or migrating of particles that are possibly present. According to the present invention this is achieved in that the holding element (3) is designed as a vibrating holding element (3) for generating levitation waves.

Abstract: A device for assembly of components, in particular semiconductor chips, on a substrate having a first traversing unit for picking up the component together with a component holder at a first location and setting down the component at a second location on the substrate is described, a position measuring unit for optically determining an actual position of the component as a function of an actual position of the substrate being situated on an optical traversing unit for traversing the position measuring unit from a working position in the area of the substrate to a resting position; this permits fully automatic assembly of a wide variety of components on substrates and at the same time has a high throughput in interlinked production and a very high positioning precision. This is achieved by the fact that the substrate is situated on a conveyance device for largely continuous supply and removal of numerous substrates to and from the device.