Patents by Inventor Michael Hoejstroem

Michael Hoejstroem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive ostomy wafer including a stoma-receiving hole and a neutralizer contained in an envelope, with the envelope extending to an edge of the stoma-receiving hole
    Patent number: 11559424
    Abstract: An adhesive ostomy wafer includes a first adhesive, a skin-facing adhesive located proximal of the first adhesive, and a neutralizer located in an envelope that is contained by the first adhesive and the skin-facing adhesive. The adhesive ostomy wafer includes a stoma-receiving hole formed through wafer such that the first adhesive, the neutralizer, and the skin-facing adhesive are exposed within the stoma-receiving hole.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: January 24, 2023
    Assignee: Coloplast A/S
    Inventors: Anders Grove Sund, Esben Stroebech, Philip Holler Langhorn, Carsten Sletten, Michael Hoejstroem
  • ADHESIVE OSTOMY WAFER INCLUDING A STOMARECEIVING HOLE AND A NEUTRALIZER CONTAINED IN AN ENVELOPE, WITH THE ENVELOPE EXTENDING TO AN EDGE OF THE STOMA-RECEIVING HOLE
    Publication number: 20220175572
    Abstract: An adhesive ostomy wafer includes a first adhesive, a skin-facing adhesive located proximal of the first adhesive, and a neutralizer located in an envelope that is contained by the first adhesive and the skin-facing adhesive. The adhesive ostomy wafer includes a stoma-receiving hole formed through wafer such that the first adhesive, the neutralizer, and the skin-facing adhesive are exposed within the stoma-receiving hole.
    Type: Application
    Filed: February 23, 2022
    Publication date: June 9, 2022
    Inventors: Anders Grove Sund, Esben Stroebech, Philip Holler Langhorn, Carsten Sletten, Michael Hoejstroem
  • Adhesive wafer with an integrated release layer
    Patent number: 11291578
    Abstract: An adhesive wafer for an ostomy device, the wafer comprising a first adhesive layer, a backing layer on the distal side of the first adhesive layer, a second skin facing adhesive layer and a hole for accommodating a stoma. Embedded between the adhesive layers is a release layer capable of releasing a neutralizing compound to the peristomal skin.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: April 5, 2022
    Assignee: Coloplast A/S
    Inventors: Anders Grove Sund, Esben Stroebech, Philip Holler Langhorn, Carsten Sletten, Michael Hoejstroem
  • An Adhesive Wafer with an Integrated Release Layer
    Publication number: 20210275342
    Abstract: An adhesive wafer for an ostomy device, the wafer comprising a first adhesive layer, a backing layer on the distal side of the first adhesive layer, a second skin facing adhesive layer and a hole for accommodating a stoma. Embedded between the adhesive layers is a release layer capable of releasing a neutralizing compound to the peristomal skin.
    Type: Application
    Filed: February 20, 2018
    Publication date: September 9, 2021
    Inventors: Anders Grove Sund, Esben Stroebech, Philip Holler Langhorn, Carsten Sletten, Michael Hoejstroem