Abstract: The invention relates to a two-component polyurethane adhesive, in particular for laminating films, wherein the PU adhesive, based on the total weight of the laminating adhesive composition, (a) contains as resin component at least one NCO-terminated polyurethane pre-polymer having a content, based on the total weight of the resin component, of at least 40 wt % of diphenylmethanedi-isocyanate (MDI), wherein the MDI is 4,4?-diphenylmethanediisocyanate or a mixture thereof with 2,4?-diphenylmethanediisocyanate, and 2 to 20 wt % of polyglycol having a molecular weight Mw of 200 to <1000 g per mol, and (b) contains as hardener component a polyol mixture comprising 2, 3, or more different polyols and is free of polyesters. The invention further relates to the use of the adhesive for bonding films, to methods for producing composite films, and to composite films bonded with the adhesive described.

Abstract: The invention relates to a 2-component polyurethane adhesive, in particular for laminating films, wherein the PU adhesive, based on the total weight of the laminating adhesive composition, (a) contains as resin component at least one NCO-terminated polyurethane pre-polymer having a content of at least 40% by weight of diphenylmethandiisocyanate (MDI), wherein the MDI is 4,4?-diphenylmethandiisocyanate or a mixture thereof with 2,4?-diphenylmethandiisocyanate, and (b) contains as hardener component a polyol mixture comprising at least three different polyols. The invention further relates to the use of the adhesive for adhesively bonding films, to methods for producing composite films, and to composite films bonded by means of the described adhesive.

Abstract: A two-component composition consisting of a component A comprising epoxides having a number-average molecular weight (Mn) of 150 to 5000 g/mol and at least 2 epoxide groups per molecule, a component B comprising a reaction product prepared from araliphatic polyamides and optionally further amines, unsaturated carboxylic acids and/or derivatives thereof and aliphatic and/or aromatic polyepoxides in a molar ratio of amine to the sum total of unsaturated carboxylic acid and/or derivatives thereof and polyepoxide of 1:0.4 to 1:0.95, to give a product having primary amino groups and having a number-average molecular weight (Mn) below 5000 g/mol.

Abstract: A method for adhesively bonding film-like substrates, in which a two-component polyurethane adhesive is applied to a film and then a second film is applied, a two-component polyurethane adhesive being used that consists of—a component A containing at least one prepolymer having at least two NCO groups,—a component B containing at least one polymeric or oligomeric crosslinker having at least two groups that react with NCO groups, wherein component B contains 0.05 to 5 wt. % of a low-molecular-weight compound C, which—should have a nucleophilic group that reacts with NCO groups and—contains a hydrogen-bridging group, selected from O?C—O? or O?C—C—O? or O?C—C?C—O? or protonated forms.

Abstract: A method for adhesively bonding film-like substrates, in which a two-component polyurethane adhesive is applied to a film and then a second film is applied, a two-component polyurethane adhesive being used that consists of—a component A containing at least one prepolymer having at least two NCO groups,—a component B containing at least one polymeric or oligomeric crosslinker having at least two groups that react with NCO groups, wherein component B contains 0.05 to 5 wt. % of a low-molecular-weight compound C, which—should have a nucleophilic group that reacts with NCO groups and—contains a hydrogen-bridging group, selected from O?C—O? or O?C—C—O? or O?C—C?C—O? or protonated forms.

Abstract: The invention relates to a two-component composition consisting of a component A containing a polymer with a molecular weight of 250 to 5000 g/mol which has at least 2 epoxy groups per molecule, a component B containing a compound of the formula (I) R1-phenyl-(—O—R2)a where R1=H, C1 to C6-alkyl, a=1, 2, or 3, R2=—O—CH2—CHOH—CH2—NH—CH2-phenyl-CH2—NH2, wherein the epoxy/NH ratio of the components A to B is between 0.75:1 to 1.25:1.