Patents by Inventor Michael Hoenle

Michael Hoenle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a connection between component parts
    Patent number: 11694977
    Abstract: In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: July 4, 2023
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Simeon Katz, Sophia Huppmann, Michael Hoenle, Thorsten Wagner, Kurt Hingerl
  • Method for Producing a Connection Between Component Parts
    Publication number: 20210035934
    Abstract: In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts
    Type: Application
    Filed: May 8, 2019
    Publication date: February 4, 2021
    Inventors: Simeon Katz, Sophia Huppmann, Michael Hoenle, Thorsten Wagner, Kurt Hingerl